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Atmospheric Pressure Plasma

  • CCP (Surfx)
  • Plasma Jet (PlasmaTreat)
  • Conical Nozzle
  • Slot Nozzle

Contact Ziyi Pan

Thin-Film Deposition

  • Ultrasonic Spray Coating
  • Open-Air CVD
  • Thermal Evaporator
  • Spin Coating
  • Air Blade

Contact Austin Flick

Mechanical Testing

  • DCB
  • Nanoindentation
  • Wafer Curvature
  • Kinetic Impactor
  • Bulge Testing

Contact Sebastian Hendrickx-Rodriguez

Thermal Processing

  • Inert Gas Oven (Max 600 oC)
  • Vacuum Oven (Max 300 oC)
  • High Temperature Hot Plate (Max 600 oC)
  • Large Area Near Infrared Flash Curing (Max 300 oC)
  • Small Area Near Infrared Flash Curing With Air

Contact David William Collinson

Environmental Aging Chambers

  • Heat/Humidity Control
  • Thermal Cycling
  • UV Exposure
  • 1-sun Exposure
  • Perovskite Degradation Imaging Chamber

Contact Jessica Huxel

Solar Testing Suite

  • Solar simulators
  • LBIC
  • 4-pt probe
  • EQE
  • CV
  • Keyence

Contact Justin Chen

Manufacturing Sample Processing

  • 3D Printing
  • Laser Cutting
  • Conventional Machining
  • Human Tissue Processing

Contact Gabriel Badillo Crane


  • Abaqus
  • Sherlock
  • Machine Learning

Contact Omar Elsafty




The Dauskardt lab in the Department of Materials Science and Engineering at Stanford University is equipped with extensive capabilities for materials synthesis, processing, high-resolution micromechanical testing, chemical and nanostructural characterization, and computational modeling. 


  • Full wet chemical synthetic capabilities for precursor synthesis
  • Sol-gel processing including spin-stations, dip and spraying capabilities
  • Plasma enhanced chemical vapor deposition
  • Atmospheric plasma deposition system with heated vaporizer (conductive coupling plasma systems and dielectric discharge barrier plasma systems)
  • Inert gas and vacuum oven together with UV ozone surface cleaning capabilities
  • Inert nitrogen glovebox for solution-processing of organic and perovskite solar cells
  • Additional extensive PVD, PE-CVD, lithography, etching, and spin-coating capabilities through the Center for Integrated Systems
  • Complete analytical services, including DTA, DSC, Density, etc.

Mechanical Testing

  • Ultra high-resolution, micro-mechanical testing system equipped with either manual or piezoelectric translators (displacement resolution of < 10 nm) with in situ optical microscopy, AFM and high speed data acquisition and computer control
  • Environmental control chamber for adhesion and cohesion testing (inert gas, 0.1 - 100% R.H. and aqueous environments, high temperature to 300oC) and high speed data acquisition and control
  • Environmental control systems with in situ UV irradiation with controlled wavelength for adhesion and cohesion testing (inert gas, 0.1 - 100% R.H., high temperature stability) and high speed data acquisition and control
  • Strain and displacement measuring systems for fully automated compliance and crack length measurement
  • High-resolution digital optical imaging and photographic equipment with precision positioning
  • Nano indentation systems and wafer curvature testing systems with environmental control
  • Surface acoustic wave (SAWS) capabilities for elastic property measurements


  • Scanning and atomic resolution transmission electron microscopes
  • Focused Ion Beam capabilities
  • Raman and fluorescence microprobe analysis for phase and strain (stress) measurement
  • X-ray diffraction facilities including reflectivity
  • Scanning tunneling and atomic force microscopes
  • XPS, FTIR, SIMS facilities
  • NMR facilities with MAS

Computation Capabilities

  • The Dauskardt group has a cluster of gigabit switch networked servers (48 cpus).
  • The Dauskardt group owns two nodes (each with 24 cpus) in high performance computing cluster Sherlock which is operated by the Stanford Research Computing Center.

Shared Facilities

  • SNF
  • X-Ray Lab
  • SMF
  • PRL