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Characterization Techniques and Processing

Mechanical Testing

Atmospheric Pressure Plasma

  • CCP (Surfx)
  • Plasma Jet (PlasmaTreat)
  • Conical Nozzle
  • Slot Nozzle

Contact Austin Flick

Thin-Film Deposition

  • Ultrasonic Spray Coating
  • Open-Air CVD
  • Thermal Evaporator
  • Spin Coating
  • Air Blade

Contact Austin Flick

Thermal Processing

  • Inert Gas Oven (Max 600 oC)
  • Vacuum Oven (Max 300 oC)
  • High Temperature Hot Plate (Max 600 oC)
  • Large Area Near Infrared Flash Curing (Max 300 oC)
  • Small Area Near Infrared Flash Curing With Air

Contact Thomas William Colburn

Environmental Aging Chambers

  • Heat/Humidity Control
  • Thermal Cycling
  • UV Exposure
  • 1-sun Exposure
  • Perovskite Degradation Imaging Chamber

Contact William Cai, Justin Chen

Solar Testing Suite

  • Solar simulators
  • LBIC
  • 4-pt probe
  • EQE
  • CV
  • Keyence

Contact Justin Chen

Manufacturing Sample Processing



The Dauskardt lab in the Department of Materials Science and Engineering at Stanford University is equipped with extensive capabilities for materials synthesis, processing, high-resolution micromechanical testing, chemical and nanostructural characterization, and computational modeling. 


  • Full wet chemical synthetic capabilities for precursor synthesis
  • Sol-gel processing including spin-stations, dip and spraying capabilities
  • Plasma enhanced chemical vapor deposition
  • Atmospheric plasma deposition system with heated vaporizer (conductive coupling plasma systems and dielectric discharge barrier plasma systems)
  • Inert gas and vacuum oven together with UV ozone surface cleaning capabilities
  • Inert nitrogen glovebox for solution-processing of organic and perovskite solar cells
  • Additional extensive PVD, PE-CVD, lithography, etching, and spin-coating capabilities through the Center for Integrated Systems
  • Complete analytical services, including DTA, DSC, Density, etc.

Mechanical Testing

  • Ultra high-resolution, micro-mechanical testing system equipped with either manual or piezoelectric translators (displacement resolution of < 10 nm) with in situ optical microscopy, AFM and high speed data acquisition and computer control
  • Environmental control chamber for adhesion and cohesion testing (inert gas, 0.1 - 100% R.H. and aqueous environments, high temperature to 300oC) and high speed data acquisition and control
  • Environmental control systems with in situ UV irradiation with controlled wavelength for adhesion and cohesion testing (inert gas, 0.1 - 100% R.H., high temperature stability) and high speed data acquisition and control
  • Strain and displacement measuring systems for fully automated compliance and crack length measurement
  • High-resolution digital optical imaging and photographic equipment with precision positioning
  • Nano indentation systems and wafer curvature testing systems with environmental control
  • Surface acoustic wave (SAWS) capabilities for elastic property measurements


  • Scanning and atomic resolution transmission electron microscopes
  • Focused Ion Beam capabilities
  • Raman and fluorescence microprobe analysis for phase and strain (stress) measurement
  • X-ray diffraction facilities including reflectivity
  • Scanning tunneling and atomic force microscopes
  • XPS, FTIR, SIMS facilities
  • NMR facilities with MAS

Computation Capabilities

  • The Dauskardt group has a cluster of gigabit switch networked servers (48 cpus).
  • The Dauskardt group owns two nodes (each with 24 cpus) in high performance computing cluster Sherlock which is operated by the Stanford Research Computing Center.

Shared Facilities

  • SNF
  • X-Ray Lab
  • SMF
  • PRL