The adhesion at organic/metal interface is of paramount importance to the performance and reliability of emerging 3D device technologies. It is also a vital parameter that has a significant bearing on other aspects of materials’ properties such as electro-migration. Our subgroup focuses specifically on studying the fundamentals of adhesion and exploring the different ways for adhesion enhancement while also examining the boost in properties in the related areas.
Current Reserach Projects
- Spray Deposition of Compositionally Graded Hybrid Layers for High-Performance Adhesion
- Adhesion to Copper: Simultaneous Cu-oxide Reduction and Hybrid-layer Formation
- Adhesion to Silicon: Exploring the Kinetics of Hybrid-layer Formation
- Hybrid Organic/Inorganic Materials for High-Performance Bonding of Polymer/Si Interfaces