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Publications

Book Editings

  1. B. N. Cox, R. H. Dauskardt and R. O. Ritchie, eds., "Mechanical Fatigue of Advanced Materials," Proceedings of the First International Engineering Foundation Conference on Fatigue of Advanced Materials, Santa Barbara, CA, January 1991, MCEP Publishers, UK, 1991.
  2. A. Inoue, A. R. Yavari, W. L. Johnson, and R. H. Dauskardt, eds., “Supercooled Liquid, Bulk Glassy and Nanocrystalline States of Alloys,” Symposium Proceedings Volume 644, Materials Research Society, Warrendale, PA, 2001.
  3. F. P. McCluskey, J. Boudreaux, H. Last, and R. H. Dauskardt, eds., “Microelectronics and Microsystems Packaging,” Symposium N Proceedings, Materials Research Society, Warrendale, PA, 2001.
  4. W. W. Gerberich and R. H. Dauskardt, Special issue on “Fracture Nanomechanics,” International Journal of Fracture, Kluwer Academic Press, Dordrecht, Netherlands, volume 119/120, 2003.
  5. W. O. Soboyejo, R. H. Dauskardt and R. O. Ritchie, Special issue on “Fatigue of Advanced Materials,” Mechanics of Materials, Elsevier, The Netherlands, volume 36, 2004.

Text Books

  1. R. H. Dauskardt and R. O. Ritchie, "Pyrolytic Carbon Coatings," chapter 13 in An Introduction to Bioceramics, L. L. Hench and J. Wilson, eds., World Scientific Publishing Co., Singapore, pp. 261-279, 1993.
  2. Kemal Levi and Reinhold H. Dauskardt, "Biomechanics of the Barrier Function of Human Stratum Corneum," The Art and Science of Moisturizers, 2011.

Editorials

  1. Krysta Biniek and Reinhold H. Dauskardt, “Can understanding the effect of solar UV radiation on skin’s biomechanical function help prevent skin damage?”  Editorial article in Expert Review of Dermatology, 8 [1], 5-6, 2013.

Archival Journals

  1. Seok-In Na, You-Hyun Seo, Yoon-Chae Nah, Seok-Soon Kim, Hyojung Heo, Jueng-Eun Kim, Nicholas Rolston, Reinhold H. Dauskardt, Mei Gao, Youngu Lee, and Doojin Vak, “High performance roll-to-roll produced fullerene-free organic photovoltaic devices via temperature-controlled slot die coating,” 2018. Under review.
  2. Nick Bosco, Jared Tracy and Reinhold Dauskardt, “Environmental Influence on Module Delamination Rate,” IEEE Journal of Photovoltaics, 2018. Under review.
  3. Jared Tracy, Nick Bosco and Reinhold Dauskardt, “Encapsulant Adhesion to Surface Metallization on Photovoltaic Cells,” IEEE Journal of Photovoltaics, 2018. Under review.
  4. Robert Tang-Kong, Roy Winter, Ryan Brock, Jared Tracy, Moshe Eizenberg, Reinhold H. Dauskardt, and Paul C. McIntyre, “Improved Catalyst Adhesion as a Mechanism for ALD-TiO2 Protection of Water Splitting Silicon Anodes,” Advanced Energy Materials, 2018. Under review.
  5. Dingchang Lin, Pak Yan Yuen, Yayuan Liu, Wei Liu, Nian Liu, Yi Cui, Reinhold H. Dauskardt, “A silica aerogel reinforced composite polymer electrolyte with high ionic conductivity and high modulus,” Nature Communications, 2018. Under review.
  6. Jacob R. Bow, Yoshihiko Sonoki, Masayuki Uchiyama, Reinhold H. Dauskardt, “Role of Keratin Dispersants on Stratum Corneum Biomechanical Properties,” Journal of Dermatological Science, 2018. Under review.
  7. Can Wang, Scott G. Isaacson, Krystelle Lionti, Willi Volksen, Teddie P. Magbitang, Reinhold H. Dauskardt, and Geraud Dubois, “Surface Chemistry Effects of Molecularly Confined Polymers in Hybrid Nanocomposites,” Nano Letters, 2018. Under review.
  8. Young Jun Tak, Florian Hilt, Scott Keene, Won-Gi Kim, Reinhold H. Dauskardt, Alberto Salleo, Hyun Jae Kim, “High-throughput open-air plasma activation of indium gallium zinc oxide thin films with low thermal budget,” NPG Asia Materials, 2018. Under review.
  9. Kristina Kutukova1, Sven Niese, Jeff Gelb, Reinhold Dauskardt, Ehrenfried Zschech, “A novel micro-Double Cantilever Beam (micro-DCB) test in an X-ray microscope to study crack opening and propagation in materials and structures,” Applied Physics Letters, 2018. Under review.
  10. Jared Tracy, Nick Bosco, Chris Delgado, and Reinhold Dauskardt, “Durability of Ionomer Encapsulants in Photovoltaic Modules,” Solar Energy Materials and Solar Cells, 2018. Under review.
  11. Christopher Berkey, Nozomi Oguchi, Kazuyuki Miyazawa and Reinhold Dauskardt, “The Role of Formulation and Photostability in the Design of Sunscreens to Protect the Biomechanical Barrier Function of Skin,” Skin Pharmacology and Physiology, 2017. Under review.
  12. Scott G. Isaacson, Yusuke Matsuda, Krystelle Lionti, Theo Frot, Willi Volksen, Reinhold H. Dauskardt, Geraud Dubois, “Using Unentangled Oligomers to Toughen Materials,” ACS Applied Materials and Interfaces, 2017. Under review.
  13. Can Cai, David C. Miller, Ian A. Tappan, Reinhold H. Dauskardt, "Framework for Predicting the Photodegradation of Adhesion of Silicone Encapsulants," Solar Energy Materials and Solar Cells, 2018. Under review.
  14. Francesca Iacopi, Tim Gould1, John J. Boeckl, Neeraj Mishra, Dayle Godin1, Aiswarya Pradeepkumar, Benjamin V. Cunning, Barry Wood, Ryan E. Brock, Reinhold H. Dauskardt, Sima Dimitrijev, “Graphene as a p-type metal for ultimate miniaturization,” Science. Under review.
  15. Marta Giachino, T.S. Kim, S.M Liff, N. Ananthakrishnan, and R. H. Dauskardt, "Mitigating Moisture-Assisted Debonding of Toughened Underfill Epoxies with Hybrid Adhesive Films" Journal of Materials Research, 2017. Under review.
  16. Nicholas Rolston, Kevin A. Bush, Adam D. Printz, Aryeh Gold-Parker, Yichuan Ding, Michael F. Toney, Michael D. McGehee, and Reinhold H. Dauskardt, “Engineering Stress in Perovskite Solar Cells to Improve Stability,” Advanced Energy Materials, 2018. In press.
  17. Qiran Xiao, Joseph A. Burg, Yao Zhou, Hao Yan, Can Wang, Yichuan Ding, Evan Reed, Robert D. Miller and Reinhold H. Dauskardt, “Electrically Conductive Copper Core–Shell Nanowires through Benzenethiol-Directed Assembly,” Nanoletters, 2018. In press.
  18. Dechan Angmo, Xiaojin Peng, Mei Gao, Nicholas Rolston, Kallista Sears, Chuantian Zuo, Jegadesan Subbiah, Seok-Soon Kim, Hasitha Weerasinghe, Jinshu Cheng, Reinhold H. Dauskardt, and Doojin Vak, “Beyond fullerenes: Indacenodithienol-based organic charge transport layer towards upscaling of perovskite solar cells,” Advanced Energy Materials, 2018. In press.
  19. Krysta Biniek, Ali Tfayli, Raoul Vyumvuhore, Alessia Quatela, Marie-Florence Galliano, Alexandre Delalleau, Arlette Baillet-Guffroy, Reinhold Dauskardt, Helene Duplan, “Measurement of the Biomechanical Function of Drying Skin and its Modulation with Emollient Mixtures,” Experimental Dermatology, 2018. In press.
  20. Jared Tracy, Dagmar R. D’hooge, Nick Bosco, Chris Delgado, and Reinhold Dauskardt, “Evaluating and Predicting Molecular Mechanisms of Adhesive Degradation During Field and Accelerated Aging of Photovoltaic Modules,” Progress in Photovoltaics, 2018. In press.
  21. Yichuan Ding, Siming Dong, Florian Hilt, and Reinhold H. Dauskardt, “Open-Air Spray Plasma Deposited UV-Absorbing Nanocomposite Coatings,” Nanoscale, 10, 14525 – 14533, 2018.
  22. Kristina Kutukova, Sven Niese, Jeff Gelb, Reinhold Dauskardt, Ehrenfried Zschech, “A novel micro-Double Cantilever Beam (micro-DCB) test in an X-ray microscope to study crack propagation in materials and structures,” Materials Today Communications, 16, 293-299, 2018.
  23. Kevin Bush, Nicholas Rolston, Aryeh Gold-Parker, Manzoor Aryeh, Jakob Hausele, Zhengshan Yu, James Raiford,  Rongrong Cheacharoen, Zachary Holman, Michael Toney, Reinhold Dauskardt, Michael McGehee, "Controlling Thin Film Stress and Wrinkling During Perovskite Film Formation," ACS Energy Letters 3, 1225−1232, 2018.
  24. Farhan Ansari, Yichuan Ding, Lars Berglund, and Reinhold H. Dauskardt, "Towards Sustainable Multifunctional Coatings Containing Nanocellulose in a Hybrid Glass Matrix," ACS Nano, 2018.
  25. Lianfeng Zhao, Nicholas Rolston, Kyung Min Lee, Xunhua Zhao, Marcos A. Reyes-Martinez, Weiwei Meng, Nhu L. Tran, Yao-Wen Yeh, Nan Yao, Gregory D. Scholes, Yanfa Yan, Yueh-Lin Loo, Annabella Selloni, Reinhold H. Dauskardt, Barry P. Rand, “Influence of Bulky Organo-ammonium Halide Additive Choice on the Flexibility and Efficiency of Perovskite Light Emitting Devices,” Advanced Functional Materials, 2018.
  26. Yichuan Ding, Siming Dong, Jiahao Han, Dongjing He, Zhenlin Zhao and Reinhold H. Dauskardt, “Optically Transparent Protective Coating for Plastics Using Dual Spray and Atmospheric Plasma Deposition,” Advanced Materials & Interfaces, 2018.
  27. Florian Hilt, Michael Q. Hovish, Nicholas Rolston, Karsten Bruning, Christopher J. Tassone and Reinhold H. Dauskardt, “Rapid route to efficient, scalable, and robust perovskite photovoltaics in air,” Energy and Environmental Science, 2018.
  28. Rongrong Cheacharoen, Nicholas Rolston, Duncan Harwood, Kevin A. Bush, and Reinhold H. Dauskardt, & Michael D. McGehee, Design and understanding of encapsulated perovskite solar cells to withstand thermal cycling, Energy and Environmental Science, 11,144-150, 2018.
  29. Silvia Prolongo, Adam D. Printz, Nicholas Rolston, Brian L. Watson & Reinhold H. Dauskardt, “Poly (triarylamine) composites with carbon nanomaterials for highly transparent and conductive coatings,” Thin Solid Films, 646, 61-66, 2018.
  30. Ryan E. Brock, Peter Hebert, James Ermer, Reinhold H. Dauskardt, “Degradation of Multijunction Photovoltaic Gridlines Induced via Thermal Cycling,” Solar Energy Materials & Solar Cells, 2017. 
  31. Zhen Wang, Misha C Tran, Namrata J Barbhaiya, Alexander W Hsing, Carol Chen, Marie LaRussa, Ernst Fattakhov, Vania Rashidi, Kyu Yun Jang, Kevin J Choo, Zingju Nie, Jonathan A Mathy, Michael T Longaker, Reinhold H Dauskardt, Jill A Helms, and George P Yang, "DEL1 knockout mice developed more severe osteoarthritis associated with increased susceptibility of chondrocytes to apoptosis" (reference number: NMED-L68919), Arthritis and Rheumatology, 2017. In press.
  32. Michael T. Barako, Scott G. Isaacson, Feifei Lian, Eric Pop, Reinhold H. Dauskardt, Kenneth E. Goodson, and Jesse Tice, “Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials,” ACS Applied Materials and Interfaces, 9 (48), pp 42067–42074, 2017.
  33. Nicholas Rolston, Adam D. Printz, Jared M. Tracy, Hasitha Weerasinghe, Doojin Vak, Lew Jia Haur, Anish Priyadarshi, Nripan Mathews, Daniel J. Slotcavage, Michael D. McGehee, Roghi E. Kalan, Kenneth Zielinski, Ronald L. Grimm, Hsinhan Tsai, Wanyi Nie, Aditya D. Mohite, Somayeh Gholipour, Michael Saliba, Michael Graetzel, and Reinhold H. Dauskardt, “Effect of cation composition on the mechanical stability of perovskite solar cells,” Advanced Energy Materials, 1702116, 2017.
  34. Joseph A. Burg, Mark S. Oliver, Geraud Dubois, and Reinhold H. Dauskardt, “Hyperconnected Molecular Glass Network Architectures with Exceptional Elastic Properties,” Nature Communications, 8, 2017.
  35. Jared Tracy, Nick Bosco, and Reinhold Dauskardt, “Encapsulant Adhesion to Surface Metallization on Photovoltaic Cells,” IEEE Journal of Photovoltaics, 7[6], 2017.
  36. Matthew D. Smith, Brian L. Watson, Reinhold H. Dauskardt, and Hemamala I. Karunadasa, “Broadband Emission with a Massive Stokes Shift from Sulfonium Pb−Br Hybrids,” Chemistry of Materials, 29 (17), pp 7083–7087, 2017.
  37. Doreen Chan, Yichuan Ding, Reinhold H. Dauskardt, Eric A. Appel,  “Engineering the Mechanical Properties of Polymer Networks with Precise Doping of Primary Defects,” ACS Applied Materials & Interfaces, 9, pp 42217–42224. 2017.
  38. Scott G. Isaacson, Jade I. Fostvedt, Hilmar Koerner, Jeffrey W. Baur, Krystelle Lionti, Willi Volksen, Geraud Dubois,and Reinhold H. Dauskardt, “Synthesis of Polyimides in Molecular-Scale Confinement for Low Density Hybrid Nanocomposites,” Nano Letters, 17, 7040-7044, 2017.
  39. Yichuan Ding, Qiran Xiao, Reinhold H. Dauskardt, “Molecular Design of Confined Organic Network Hybrids with Controlled Deformation Rate Sensitivity and Moisture Resistance,” Acta Materialia, 142, 162-171, 2017.
  40. Joseph Burg and Reinhold H Dauskardt, "The Effects of Terminal Groups on Elastic Asymmetries in Hybrid Molecular Materials," Journal of Physical Chemistry B, 121 (41), 9753–9759, 2017.
  41. Brian L. Watson, Nicholas Rolston, Adam D. Printz, and Reinhold H. Dauskardt, “Scaffold-Reinforced Perovskite Compound Solar Cells,” Energy & Environmental Science, 10, 2500-2508, 2017.
  42. Nick Bosco, Sarah Kurtz, Jared Tracy and Reinhold Dauskardt, “Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability,” IEEE Journal of Photovoltaics, 7[6]. 1536-1540, 2017.
  43. Jared Tracy, Nick Bosco and Reinhold Dauskardt, “Evaluation of Encapsulant Adhesion to Surface Metallization of Photovoltaic Cells,” IEEE Journal of Photovoltaics, 7 [6], 1635-1639, 2017.
  44. Nicholas Rolston, Adam D. Printz, Florian Hilt, Michael Q. Hovish, Karsten Bruening, Christopher J. Tassone, and Reinhold H. Dauskardt “Improved Efficiency and Stability of Perovskite Solar Cells with Submicron Flexible Barrier Films Deposited in Air,” Journal of Materials Chemistry A, 5, 22975 – 22983, 2017.
  45. Nick Bosco, Jared Tracy, and Reinhold Dauskardt, “Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability,” IEEE Journal of Photovoltaics, 7 [6], 2156-3381, 2017.
  46. Brian Watson, Nicholas Rolston, Kevin Bush, Leila Taleghani, and Reinhold H. Dauskardt, “Synthesis and Use of a Hyper-Connecting Cross-linking Agent in the Hole-transporting Layer of Perovskite Solar Cells," Journal of Materials Chemistry A, 5, 19267 – 19279, 2017.
  47. Jared Tracy, Yikai Yin, Jeff Yang, John Osborne, Kay Blohowiak, and Reinhold Dauskardt, “Environmentally Assisted Crack Growth in Adhesively Bonded Composite Joints,” Composites Part A, 102C, 368-377, 2017.
  48. Nicholas Rolston, Adam D. Printz, Stephanie R. Dupont, Eszter Voroshazi, and Reinhold H. Dauskardt, “Effect of Heat, UV Radiation, and Moisture on the Decohesion Kinetics of Inverted Organic Solar Cells,” Solar Energy Materials and Solar Cells, 170, 239-245, 2017.
  49. Jared Tracy, Nick Bosco, Fernando Novoa and Reinhold Dauskardt, “Encapsulation and Backsheet Adhesion Metrology for Photovoltaic Modules,” Progress in Photovoltaics: Research and Applications, 25:87–96, 2017.
  50. William Greenbank, Nicholas Rolston, Elodie Destouesse, Guillaume Wantz, Lionel Hirsch, Reinhold H. Dauskardt, Sylvain Chambon, “Improved mechanical adhesion and electronic stability of organic solar cells with thermal ageing: the role of diffusion at the hole extraction interface,” Journal of Materials Chemistry A, 5, 2911-2919, 2017.
  51. Jae-Han Kim, Inhwa Lee, Taek-Soo Kim, Nicholas Rolston, Brian L. Watson, and Reinhold H. Dauskardt, Understanding mechanical behavior and reliability of organic electronic materials, Materials Research Society Bulletin, 2017.
  52. Yayuan Liu, Dingchang Lin, Pak Yan Yuen, Kai Liu, Jin Xie, Reinhold H. Dauskardt, Yi Cui, “An Artificial Solid Electrolyte Interphase with High Li-ion Conductivity, Mechanical Strength and Flexibility for Stable Lithium Metal Anode,” Advanced Materials, 1605531, 2017.
  53. Hasitha C. Weerasinghe, Nicholas Rolston, Doojin Vak, Andrew Scully, and Reinhold H. Dauskardt, A stability study of printed organic photovoltaic modules containing a polymeric electron-selective layer, Solar Energy Materials and Solar Cells, 2016.
  54. Qiran Xiao, Brian Watson and Reinhold H. Dauskardt, "Organothiol-Based Hybrid-Layer Strategy for High-Performance Copper Adhesion and Stress-Migration via Simultaneous Oxide Reduction," Advanced Materials Interfaces, 3, 14, 2016.
  55. Zhen Wang, Misha Tran, Namrata Bhatia, Alexander Hsing, Carol Chen, Marie LaRussa, Ernst Fattakhov, Vania Rashidi, Kyu Yun Jang, Kevin Choo, Xingju Nie, Jonathan Mathy, Michael Longaker, Reinhold Dauskardt, Jill Helms, George P Yang, "DEL1 knockout mice developed more severe osteoarthritis associated with increased susceptibility of chondrocytes to apoptosis," 11, 8, PLoS one, 2016.
  56. Brian L. Watson, Nicholas Rolston, Kevin A. Bush, Tomas Leijtens, Michael D. McGehee, and Reinhold H. Dauskardt, “Cross-linkable, Solvent-resistant Fullerene Contacts for Robust and Efficient Perovskite Solar Cells with Increased JSC and VOC,” ACS Applied Materials & Interfaces, 2016. In press.
  57. Jared Tracy, Nick Bosco, Fernando Novoa and Reinhold Dauskardt, “Encapsulation and Backsheet Adhesion Metrology for Photovoltaic Modules,” Progress in Photovoltaics, 2016. In press.
  58. Hasitha Chandana Weerasinghe, Nicholas Rolston, Reinhold H. Dauskardt, “A Stability Study of Printed Organic Photovoltaic Modules Containing a Polymeric Electron-Selective Layer," Solar Energy Materials and Solar Cells, 2016. In press.
  59. Qiran Xiao, Brian Watson and Reinhold H. Dauskardt, "Organothiol-Based Hybrid-Layer Strategy for High-Performance Copper Adhesion and Stress-Migration via Simultaneous Oxide Reduction," Advanced Materials Interfaces, 2016. In press.
  60. Michael Corazza, Nicholas Rolston, Reinhold H. Dauskardt, Michail Beliatis, Frederik C. Krebs and Suren A. Gevorgyan, "Role of Stress Factors on the Adhesion of Interfaces in R2R Fabricated Organic Photovoltaics," Advanced Energy Materials, 6(11), 2016.
  61. Nicholas Rolston, Brian L. Watson, Colin D. Bailie, Michael D. McGehee, Joao Bastos, Robert Gehlhaar, Jueng-Eun Kim, Doojin Vak, Arun Tej Mallajosyula, Gautam Gupta, Aditya D. Mohite,  Reinhold H. Dauskardt, “Mechanical Integrity of Solution-Processed Perovskite Solar Cells,” Extreme Mechanics Letters, 2016. doi:10.1016/j.eml.2016.06.006.
  62. Joseph Burg and Reinhold H. Dauskardt “Elastic and Thermal Expansion Asymmetry in Dense Molecular Materials” Nature Materials, 2016. Published Online: 27 June 2016 | DOI: 10.1038/NMAT4674.
  63. Pak Yan Yuen and Reinhold H. Dauskardt, “Effect of mechanical constraint on tearing energy of polymer membranes,” Macromolecular Materials and Engineering, 2016. DOI:  10.1002/mame.201600132.
  64. Can Cai, David C. Miller, Ian A. Tappan, Reinhold H. Dauskardt, “Degradation of Thermally-Cured Silicone Encapsulant under Terrestrial UV,” Solar Energy Materials and Solar Cells, 157, 346-353, 2016. DOI information: 10.1016/j.solmat.2016.05.065.
  65. Ryan Brock, Raunaq Rewari, Fernando D. Novoa, Peter Hebert, James Ermer, David C. Miller, Reinhold H. Dauskardt, “Quantitative Adhesion Characterization of Antireflective Coatings in Multijunction Photovoltaics,” Solar Energy Materials and Solar Cells, 153, 78–83, 2016.
  66. Sasi Kumar Tippabhotla, Vincent Handara, Gregoria Illya, Arief S Budiman, Andrew A.O.Tay, Fernando  Novoa, Reinhold  H Dauskardt, “Fracture Mechanics and Testing of Interface Adhesion Strength in Multilayered Structures - Application in Advanced Solar PV Materials and Technology,” Procedia Engineering, 139, 47–55, 2016.
  67. Fernando D. Novoa, David C. Miller and Reinhold H. Dauskardt, “Adhesion and Debonding Kinetics of Photovoltaic Encapsulation in Moist Environments,” Progress in Photovoltaics: Research and Applications, 24, 183–194, 2016.
  68. Blume-Peytavi U, Tan J, Tennstedt D, Boralevi F, Fabbrocini G, Torrelo A, Soares-Oliveira R, Haftek M, Rossi AB, Thouvenin MD, Mangold J, Galliano MF, Hernandez-Pigeon H, Aries MF, Rouvrais C, Bessou-Touya S, Duplan H, Castex-Rizzi N, Mengeaud V, Ferret PJ, Clouet E, Saint Aroman M, Carrasco C, Coutanceau C, Guiraud B, Boyal S, Herman A, Delga H, Biniek K, and Dauskardt R.H., “Fragility of epidermis in newborns, children and adolescents,” Journal  of the European Academy of Dermatology Venereology, published in Supplement 4:3-56, 2016. doi: 10.1111/jdv.13636.
  69. Linying Cui, Geraud Dubois, and Reinhold H. Dauskardt, “Carbon-Bridge Incorporation in Organosilicate Coatings Using Oxidative Atmospheric Plasma Deposition,” ACS Applied Materials & Interfaces, 8 (2), 1309 – 1318, 2016.
  70. Qiran Xiao, Marta Giachino, Reinhold H. Dauskardt, “Controlling Kinetics of Heterogeneous Sol-Gel Solution for High-Performance Adhesive Hybrid Films” Journal of Sol-Gel Science and Technology, 77(3), 620-626, 2016.
  71. S.G. Isaacson, K. Lionti, W. Volksen, Y. Matsuda, T. Magbitang, R.H. Dauskardt, G. Dubois, “Fundamental Limits of Material Toughening in Confined Polymers”, Nature Materials, 15, 294-298, 2016. Pub Online: 16 Nov 2015. DOI: 10.1038/NMAT4475.
  72. Krysta Biniek, Joseph Kaczvinsky, Paul Matts, and Reinhold H. Dauskardt, “Understanding Age-Induced Alterations to the Biomechanical Barrier Function of Human Stratum Corneum,” Journal of Dermatological Science, 80, 94–101, 2015.
  73. Siming Dong, Zhenlin Zhao and Reinhold H. Dauskardt, “Dual Precursor Atmospheric Plasma Deposition of Transparent Bilayer Protective Coatings on Plastics,” ACS Applied Materials & Interfaces, 7, 17929−17934, 2015.
  74. Can Cai and Reinhold H. Dauskardt, “Nanoscale Interfacial Engineering for Flexible Barrier Films,” NanoLetters, 15 (10), 6751–6755, 2015.
  75. Marta Giachino, Brian L. Watson, Geraud Dubois, Reinhold H. Dauskardt, “Selective Deposition of Compositionally Graded Hybrid Adhesive Films,” Advanced Materials Interfaces, 2 2015. DOI: 10.1002/admi.201500262.
  76. Veerle Balcaen, Nicholas Rolston, Stephanie R. Dupont, Eszter Voroshazi, Reinhold H. Dauskardt, “Thermal cycling effect on mechanical integrity of inverted polymer solar cells,” Solar Energy Materials and Solar Cells, 143, 418-423, 2015.
  77. Marta Giachino, Geraud Dubois, Reinhold H. Dauskardt, "Molecular Design for Moisture Insensitivity of Compositionally Graded Hybrid Films," ACS Applied Materials & Interfaces, 7[12], 6812-6818, 2015.
  78. Francesca Iacopi, Neeraj Mishra, Benjamin V Cunning, Dayle Goding, Sima Dimitrijev, Ryan E Brock, Reinhold H Dauskardt, Barry Wood,  and John J Boeck, “A catalytic alloy approach for highly uniform graphene on epitaxial SiC on silicon wafers,” Journal of Materials Research, 30(5), 609-616, 2015.
  79. Naga Rajesh Tummala, Chad Risko, Christopher Bruner, Reinhold H. Dauskardt, and Jean-Luc Brédas, “Entanglements in P3HT and their Influence on Thin-Film Mechanical Properties: Insights from Molecular Dynamics Simulations,” Journal of Polymer Science, Part B: Polymer Physics, 53(13), 934-942, 2015.
  80. Naga Rajesh Tummala, Christopher Bruner, Chad Risko, Reinhold H. Dauskardt, and Jean-Luc Bredas, “A Molecular-Scale Understanding of Cohesion and Fracture in P3HT:Fullerene Blends,” ACS Applied Materials & Interfaces, 7(18), 9957-9964, 2015.
  81. Stephanie R. Dupont, Eszter Voroshazi, Dennis Nordlund, Reinhold H. Dauskardt, “Morphology and interdiffusion control to improve adhesion and cohesion properties in inverted polymer solar cells,” Solar Energy Materials and Solar Cells, 132, 443–449, 2015.
  82. Christopher Bruner, Fernando Novoa, Stephanie Dupont and Reinhold H. Dauskardt, “Decohesion Kinetics in Polymer Organic Solar Cells,” ACS Applied Materials and Interfaces, 10;6(23), 21474-83, 2014.
  83. Linying Cui, Krystelle Lionti, Alpana N. Ranade, Kjersta Larson-Smith, Geraud Dubois, and Reinhold H. Dauskardt, “Highly Transparent Multi-Functional Bilayer Coatings on Polymers Using Low Temperature Atmospheric Plasma Deposition,” ACS Nano, 8 [7], 7186 – 7191, 2014.
  84. Stephanie R. Dupont, Eszter Voroshazi, Koen Vandewal, Dennis Nordlund, Reinhold H. Dauskardt, “Controlling Interdiffusion, Interfacial Composition and Adhesion in Polymer Solar Cells,” Advanced Materials Interfaces, 1[7], 1-8, 2014.
  85. Christopher Bruner and Reinhold Dauskardt, “Role of Molecular Weight on the Mechanical Device Properties of Organic Polymer Solar Cells,” Macromolecules, 47 [3], 1117–1121, 2014.
  86. Siming Dong, Makoto Watanabe, and Reinhold H. Dauskardt, “Conductive Transparent TiNx/TiO2 Thin Films Deposited by Atmospheric Plasma on Plastic” Advanced Functional Materials, 24 [20], 3075 – 3081, 2014.
  87. Yusuke Matsuda, Ill Ryu, Sean W. King, Jeff Bielefeld, Reinhold H. Dauskardt “Toughening Device Structure with Ceramic-Like Amorphous Silicon Carbide Films,” Small, 10 [2], 253–257, 2014.
  88. Fernando D. Novoa, David C. Miller and Reinhold H. Dauskardt, “Environmental Mechanisms of Debonding in Photovoltaic Backsheets,” Solar Energy Materials and Solar Cells, 120A, 87-93, 2014.
  89. Stephanie R. Dupont, Fernando Novoa, Eszter Voroshazi, Reinhold H. Dauskardt, “Decohesion Kinetics of PEDOT:PSS Conducting Polymer Films,” Advanced Functional Materials, 24[9], 1325–1332, 2014.
  90. Makoto Watanabe, Linying Cui, Reinhold H. Dauskardt, “Atmospheric Plasma Deposition of Semiconducting Transparent ZnO Films on Plastics in Ambient Air,” Organic Electronics, 15 [3], 775–784, 2014.
  91. Raoul Vyumvuhore, Ali Tfayli, Krysta Biniek, Hélène Duplan, Alexandre Delalleau, Michel Manfait, Reinhold Dauskardt, Arlette Baillet-Guffroy, “The relationship between water loss, mechanical stress, and molecular structure of human stratum corneum ex vivo,” Journal of Biophotonics, 1-9, 2014.
  92. Lijia Pan, Alex Chortos, Guihua Yu, Yaqun Wang, Scott Isaacson, Ranulfo Allen, Yi Shi, Reinhold Dauskardt, and Zhenan Bao, “An ultra-sensitive resistive pressure sensor based on hollow-sphere microstructure induced elasticity in a conducting polymer film,” Nature Communications, 5, Art. Number 3002, 2014.
  93. Victor Wong, Ravi Garg, Michael Sorkin, Kristine Rustad, Satoshi Akaishi, Kemal Levi, Emily Nelson, Misha Tran, Robert Rennert, Wei Liu, Michael Longaker, Reinhold H. Dauskardt, Geoffrey Gurtner, “Loss of keratinocyte focal adhesion kinase stimulates dermal proteolysis through upregulation of matrix metalloproteinase 9 in wound healing,” Annals of Surgery, 260[6], 1138–1146, 2014.
  94. Marta Giachino, Geraud Dubois, Reinhold H. Dauskardt, “Heterogeneous Solution Deposition of High-Performance Adhesive Hybrid Films,” ACS Applied Materials & Interfaces, 5, 9891−9895, 2013. 
  95. Krystelle Lionti, Linying Cui, Willi Volksen, Reinhold Dauskardt, Geraud Dubois, Berangere Toury, “Independent control of adhesive and bulk properties of hybrid silica coatings on polycarbonate," ACS Applied Materials and Interfaces, 5, 11276−11280, 2013.
  96. Jeffrey Yang and Reinhold H. Dauskardt, “Hybrid Coupling Layers for Bulk Metallic Glass Adhesion,” Journal of Materials Research, 28[22], 3164 – 3169, 2013.
  97. Francesca Iacopi, Ryan E Brock, Alan V Iacopi, Leonie Hold, Reinhold H Dauskardt, “Evidence of a highly compressed nano-layer at the epitaxial silicon carbide interface with silicon,” Acta Materialia, 61, 6533–6540, 2013.
  98. Victor W. Wong, Bill Beasley, John Zepeda, Reinhold H. Dauskardt, Paul G. Yock, Michael T. Longaker, Geoffrey C. Gurtner, “A Mechanomodulatory Device to Minimize Incisional Scar Formation," Advances in Wound Care, 2[4], 185-194, 2013.
  99. Yusuke Matsuda, Namjun Kim, Sean W. King, Jeff Bielefeld, Jonathan F. Stebbins, Reinhold H. Dauskardt, “Tunable Plasticity in Amorphous Silicon Carbide Films,” ACS Applied Materials & Interfaces, 5, 7950 - 7955, 2013.
  100. Krysta Biniek and Reinhold H. Dauskardt, “Can Understanding the Effect of Solar UV Radiation on Skin’s Biomechanical Function Help Prevent Skin Damage,” Expert Review in Dermatology, 8[1], 5 – 6, 2013.
  101. Yusuke Matsuda, Sean W. King, and Reinhold H. Dauskardt, “Tailored Amorphous Silicon Carbide Barrier Dielectrics by Nitrogen and Oxygen Doping,” Thin Solid Films, 531, 552 – 558, 2013.
  102. Linying Cui, Alpana N. Ranade, Marvi A. Matos, Geraud Dubois, Reinhold H. Dauskardt, “Improved Adhesion of Dense Silica Coatings on Polymers by Atmospheric Plasma Pretreatment”, ACS Applied Materials and Interfaces, 5, 8495-8504, 2013.
  103. Christopher Bruner, Nichole C. Miller, Michael D. McGehee, and Reinhold H. Dauskardt, “Molecular Intercalation and Cohesion of Organic Bulk Heterojunction Photovoltaic Devices,” Advanced Functional Materials, 23[22], 2863 – 2871, 2013.
  104. Stephanie R. Dupont, Eszter Voroshazi, Paul Heremans, Reinhold H. Dauskardt, “Adhesion Properties of Inverted Polymer Solar Cells: Processing and Film Structure Parameters,” Organic Electronics, 14, 1262–1270, 2013.
  105. Yusuke Matsuda, Sean W. King, Mark Oliver, Reinhold H. Dauskardt, “Moisture-Assisted Cracking and Atomistic Crack Path Meandering in Oxidized Hydrogenated Amorphous Silicon Carbide Films,” Journal of Applied Physics, 113 [8], 083521-1 - 7, 2013.
  106. Shinichi Fujiwara and Reinhold H. Dauskardt, “Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating,” Materials Transactions, 53[12], 2091 – 2096, (2012). 
  107. Linying Cui, Alpana Ranade, Marvi Matos, Liam Pingree, Theo Frot, Geraud Dubois, and Reinhold H. Dauskardt, “Atmospheric Plasma Deposited Dense Silica Coatings on Plastics," ACS Applied Materials and Interfaces, 4, 6587−6598, 2012.
  108. Yongjin Kim, Anuradha Bulusu, Anthony Giordano, Seth Marder, Reinhold Dauskardt, and Samuel Graham, “An Experimental Study of Interfacial Fracture Toughness in a SiNx/PMMA Barrier Film,” ACS Applied Materials and Interfaces, 4, 6711-6719, 2012.
  109. Filip Crnogoraca, Fabian R. W. Pease, Ryan P. Birringer, and Reinhold H. Dauskardt, “Low-Temperature Al–Ge Bonding for 3D Integration,” Journal of Vacuum Science and Technology, B 30(6), Nov/Dec, 2012.
  110. Krysta Biniek, Kemal Levi and Reinhold H. Dauskardt, “Solar UV-Radiation Reduces the Barrier Function of Human Skin,” Proceedings of the National Academy of Science, 109 [42], 17111 - 17116, 2012.
  111. Filip Crnogorac, Ryan Birringer, Reinhold Dauskardt, R. F. W. Pease, "Low-Temperature Al-Ge Bonding for 3D Integration," Journal of Vacuum Science and Technology B, 30:06FK01, 2012.
  112. Yusuke Matsuda, J. S. Rathore, L. V. Interrante, R.H. Dauskardt, and G. Dubois, "Moisture-insensitive Polycarbosilane Films with Superior Mechanical Properties," ACS Applied Materials and Interfaces, 4 (5), 2659-2663, 2012.
  113. Ruiliang Jia, Siming Dong, Takuya Hasegawa, Jiping Ye and Reinhold H. Dauskardt, "Contamination and Moisture Absorption Effects on the Mechanical Properties of Catalyst Coated Membranes in PEM Fuel Cells," International Journal of Hydrogen Energy, 37, 6790 - 6797, 2012.
  114. Vitali Brand, Kemal Levi, M. McGehee and Reinhold H. Dauskardt, "Film Stresses and Electrode Buckling in Organic Solar Cells," Solar Energy Materials and Solar Cells, 103, 80–85, 2012.
  115. Vitali Brand, Christopher Bruner and Reinhold H. Dauskardt, "Cohesion and Device Reliability in Organic Bulk Heterojunction Photovoltaic Cells," Solar Energy Materials and Solar Cells, 99, 182–189, 2012. 
  116. Ryan Birringer, Roey Shaviv, Paul Besser and Reinhold Dauskardt, "Environmentally Assisted Debonding of Copper / Barrier Interfaces," Acta Materialia, 60, 2219–2228, 2012.
  117. Stephanie R. Dupont, Mark Oliver, Frederik C. Krebs, Reinhold H. Dauskardt, "Interlayer Adhesion in Roll-To-Roll Processed Flexible Inverted Polymer Solar Cells," Solar Energy Materials and Solar Cells, 97, 171–175, 2012.
  118. Yusuke Matsuda, Sean W. King, Jeff Bielefeld, Jessica Xu, and Reinhold H. Dauskardt, “Fracture Properties of Hydrogenated Amorphous Silicon Carbide Thin Films,”  Acta Materialia, 60, 682–691, 2012.
  119. Victor W. Wong, Kemal Levi, Satoshi Akaishi, Geoffrey Schultz, Reinhold H. Dauskardt, "Scar Zones: Region-Specific Differences in Skin Tension May Determine Incisional Scar Formation," Plastic and Reconstructive Surgery, 129 [6] 1272 – 1276, 2012.
  120. Ryan Birringer, Roey Shaviv, Roy H. Geiss, David Read, and Reinhold Dauskardt, "Effects of Barrier Composition and Electroplating Chemistry on Adhesion and Voiding in Copper / Dielectric Diffusion Barrier Films," Journal of Applied Physics, 110, 044312, 2011.
  121. Ruiliang Jia, Binghong Han, Kemal Levi, Takuya Hasegawa, Jiping Ye and Reinhold H. Dauskardt, “Mechanical Durability of Proton Exchange Membranes with Catalyst Platinum Dispersion," Journal of Power Sources, 196, 8234 – 8240, 2011. 
  122. Geoffrey C. Gurtner, Reinhold H. Dauskardt, Victor W. Wong, Kirit A. Bhatt, Kenneth Wu, Ivan N. Vial, Karine Padois, Joshua M. Korman, and Michael T. Longaker, "Improving Cutaneous Scar by Controlling the Mechanical Environment: Large Animal and Phase I Studies," Annals of Surgery, 254 [2] 217 – 225, 2011.
  123. Ruiliang Jia, Binghong Han, Kemal Levi, Takuya Hasegawa, Jiping Ye and Reinhold H. Dauskardt, “Effect of Cation Contamination and Hydrated Pressure Loading on the Mechanical Properties of Proton Exchange Membranes,” Journal of Power Sources, 196, 3803–3809, 2011.
  124. Kemal Levi, Alice Kwan, Allison S. Rhines, Mihaela Gorcea, David J. Moore, and Reinhold H. Dauskardt, "Effect of Glycerin on Drying Stresses in Human Stratum Corneum," Journal of Dermatological Science, 61[2], 129 - 131, 2011.
  125. Ani Kamer, Kjersta Larson-Smith, Liam S. C. Pingree and Reinhold H. Dauskardt, "Adhesion and Degradation of Hard Coatings on Poly (methyl methacrylate) Substrates," Thin Solid Films, 519 [6], 1907 - 1913, 2011.
  126. R. P. Birringer and R. H. Dauskardt, “High Yield Four-Point Bend Thin Film Adhesion Testing Techniques,” Engineering Fracture Mechanics, 78, 2390 – 2398, 2011.
  127. K. Levi, A. Kwan, A.S. Rhines, M. Gorcea, D.J. Moore, and R.H. Dauskardt, "Emollient Molecule Effects on the Drying Stresses in Human Stratum Corneum," British Journal of Dermatology, 163 [4], 695 – 703, 2010.
  128. Markus D. Ong, Patrick Leduc, Daniel W. McKenzie, Thierry Farjot, Gerard Passemard, Sylvain Maitrejean, and Reinhold H. Dauskardt, " Solution Chemistry Effects on Cracking and Damage Evolution during Chemical Mechanical Planarization," Journal of Materials Research, 25 [10], 1904 - 1909, 2010.
  129. Ryan P. Birringer, Ching-Huang Lu, Michael Deal, Yoshio Nishi, and Reinhold H. Dauskardt, “Bilayer Metal Gate Electrodes with Tunable Work Function – Adhesion and Interface Characterization,” Journal of Applied Physics, 108, 053704, 2010.
  130. Taek-Soo Kim and Reinhold H. Dauskardt, “Molecular Mobility in Nanoporous Organosilicate Thin Films,” NanoLetters, 10 [5], 1955-1959, 2010.
  131. Mark S. Oliver, Geraud Dubois, Mark H. Sherwood, David M. Gage, and Reinhold H. Dauskardt, “Molecular Origins of the Mechanical Behavior of Hybrid Glasses,” Advanced Functional Materials, 20 [17], 2884-2892, 2010.
  132. Mark Oliver and Reinhold H. Dauskardt, “Mechanical Fatigue of Hybrid Glasses,” Small, 6 [17], 1892-1896, 2010.
  133. Mark S. Oliver, Kay Y. Blohowiak, Reinhold H. Dauskardt, “Molecular Structure and Fracture Properties of Hybrid Organic-Inorganic Films,” Journal of Sol-Gel Science and Technology, 55, 360 - 368, 2010.
  134. Ching-Huang Lu, Gloria M.T. Wong, Ryan P. Birringer, Reinhold Dauskardt, Michael Deal, Bruce M. Clemens, and Yoshio Nishi, "Bilayer Metal Gate Electrodes with Tunable Work Function – Mechanism and Proposed Model," Journal of Applied Physics, 107, 063710, 2010.
  135. David M. Gage, Luming Peng, Jonathan Stebbins, Kang Sub Yim, Amir Al-Bayati, Alex Demos, and Reinhold H. Dauskardt, "Effects of e-Beam Curing on Glass Structure and Mechanical Properties of Nanoporous Organosilicate Thin Films," International Journal of Materials Research, 101, 228 - 235, 2010.
  136. K. Levi and R. H. Dauskardt, “Application of Substrate Curvature Method to Differentiate  Drying Stresses in Topical Coatings and Human Stratum Corneum,” International Journal of Cosmetic Science, 1 - 5, 2010.
  137. Taek-Soo Kim and Reinhold H. Dauskardt, “Integration Challenges of Nanoporous Low Dielectric Constant Materials,” IEEE Transactions on Device and Materials Reliability, 9 [4], 2009.
  138. Kemal Levi, Robert J. Weber, James Q. Do, and R. H. Dauskardt, “Drying Stress and Skin Damage in Human Stratum Corneum,” International Journal of Cosmetic Science, 1 - 18, 2009.
  139. Taek-Soo Kim, Dmytro Chumakov, Ehrenfried Zschech and Reinhold H. Dauskardt, “Tailoring UV Cure Depth Profiles for Optimal Mechanical Properties of Organosilicate Thin Films,” Applied Physics Letters, 95, 071902, 2009.
  140. Taek-Soo Kim, Tomohisa Konno, and Reinhold H. Dauskardt, “Surfactant-Controlled Damage Evolution during Chemical Mechanical Planarization of Nanoporous Films,” Acta Materialia, 57, 4687 - 4696, 2009.
  141. M. R. Khan, R. H. Dauskardt, M. Geyer, T. P. Pearsall and D. W. Merfeld, “Solar Power R&D,” Advanced Materials and Processes, 167 [1], 35 - 37, 2009.
  142. Taek-Soo Kim, Katherine Mackie, Qiping Zhong, Maria Peterson, Tomohisa Konno, and Reinhold H. Dauskardt, “Surfactant Mobility in Nanoporous Glass Films,” Nano Letters, 9 [6], 2427-2432, 2009.
  143. H. W. Choi, R. H. Dauskardt, S-C. Lee, K-R Lee, K. H. Oh, “Effects of Thermal Annealing and Si Incorporation on Bonding Structure and Fracture Properties of Diamond-like Carbon films,” Diamond and Related Materials, 18, 615-619, 2009.
  144. Taek-Soo Kim, Naoto Tsuji, Kiyoshiro Matsushita, Dmytro Chumakov, Holm Geisler, Ehrenfried Zschech, and Reinhold H. Dauskardt, “Tuning Depth Profiles of Organosilicate Films with Ultraviolet Curing,” Journal of Applied Physics, 104, 074113, 2008.
  145. M. R. Khan, D. W. Merfeld, T. P. Pearsall, M. Geyer and R. H. Dauskardt, “Innovations in Solar Power,” Advanced Materials and Processes, 166 [11], 45 - 48, 2008.
  146. D. M. Gage, A.D.W. Thiel, R. H. Dauskardt, M. K. Haas, L.M. Matz, M. L. O’Neill, T. M. Wieder, G. Banerjee and M. B. Rao, “Impact of CMP polish and pCMP Cleaning on adhesion of SiCN capping layer on PECVD-derived Porous OSG and Copper” Solid State Phenomena, 145-146, 377-380, 2009.
  147. D. M. Gage, J. F. Stebbins, L. Peng, Z. Cui, A. Al-Bayati, K. P. MacWilliams, H. M’Saad, and R. H. Dauskardt, “Effects of UV Cure on Glass Structure and Fracture Properties of Nanoporous Carbon-Doped Oxide Thin Films,” Journal of Applied Physics, 104, 043513, 2008.
  148. A. V. Kearney, C.S. Litteken, C.E. Mohler, M.E. Mills, R.H. Dauskardt, “Pore Size Scaling for Enhanced Fracture Resistance of Nanoporous Polymer Thin Films,”  Acta Materialia, 56, 5946–5953, 2008.
  149. B. Menzel and R. H. Dauskardt, “Fatigue Damage Initiation and Growth from Artificial Defects in Zr-Based Metallic Glass,” Acta Materialia, 56, 2955 – 2965, 2008.
  150. M. Ong, W. Volksen, G. Dubois, V. Lee, P.J. Brock, V. Deline, R. D. Miller and R. H. Dauskardt, "Molecular Controlled Fracture and Release of Templated Nanoporous Organosilicate Thin Films,” Advanced Materials, 20, 3159–3164, 2008.
  151. G. Dubois, W. Volksen, T. Magbitang, M. H. Sherwood, R. D. Miller, D. M. Gage and R. H. Dauskardt, “Superior Mechanical Properties of Dense and Porous Organic/Inorganic Hybrid Thin Films,” Journal of Sol-Gel Science and Technology, 48,187-193, 2008.
  152. K. Levi, J. Baxter, H. Meldrum, M. Misra, E. Pashkovski, and R. H. Dauskardt, “Effect of Corneodesmosome Degradation on the Intercellular Delamination of Human Stratum Corneum,” Journal of Investigative Dermatology, 128 [9], 2345 – 2347, 2008.
  153. Taek-Soo Kim, Naoto Tsuji, Kiyoshiro Matsushita, Dmytro Chumakov, Ehrenfried Zschech, and Reinhold H. Dauskardt, “Depth Dependence of Ultraviolet (UV) Curing of Organosilicate Low-K Films,” Journal of Applied Physics, 103, 064108, 2008. 
  154. H. W. Choi, R. H. Dauskardt, S-C. Lee, K-R Lee, K. H. Oh, “Characteristic of Silver Doped DLC Films on Surface Properties and Protein Adsorption,” Diamond and Related Materials  2008.  In press.
  155. D. M. Gage, K. Kim, C. S. Litteken, and R. H. Dauskardt, “The Role of Friction and Loading Parameters on Four-Point Bend Adhesion Measurements,” Journal of Materials Research, 23 [1], 87 – 96, 2008.
  156. G. Dubois, W. Volksen, T. Magbitang, R. D. Miller, D. M. Gage and R. H. Dauskardt, “Molecular Network Reinforcement of Sol-Gel Glasses,” Advanced Materials, 19, 3989–3994, 2007.
  157. K. S. Wu, J.Li, K. P. Ananthapadmanabhan, and R. H. Dauskardt, “Time-Dependant Intercellular Delamination of Human Stratum Corneum,” Journal of Materials Science, 42, 8986 – 8994, 2007.
  158. M. Jenkins Borrego, R. H. Dauskardt, and J. C. Bravman “Effect of Silane Functional Group on Adhesion of Selected Epoxies for Microelectronic Packaging,” Journal of Microelectronics and Electronic Packaging, 4 [1], 8-15, 2007.
  159. E. P. Guyer, J. Gantz and R. H. Dauskardt, “Diffusion of Aqueous Solutions into Hydrophobic Nanoporous Thin-Films,” Journal of Materials Research, 22 [3], 710-718, 2007.
  160. B. M. Sharratt, L.C. Wang, R.H. Dauskardt, “Anomalous Debonding Behavior of a Polymer/Inorganic Interface,” Acta Materialia, 55, 3601–3609, 2007.
  161. B. Menzel and R. H. Dauskardt, “Response to Comments on The Fatigue Endurance Limit of a Zr-Based Bulk Metallic Glass,” Scripta Materialia, 57, 69–71, 2007.
  162. F. Iacopia, G. Beyer, Y. Travaly, C. Waldfried, D.M. Gage, R.H. Dauskardt, K. Houthoof, P. Jacobs, P. Adriaensens, K. Schulze, S.E. Schulz, S. List, G. Carlotti, “Thermo-mechanical properties of thin organosilicate glass films treated with Ultra-Violet –assisted cure,” Acta Materialia, 55 (4), 407-1414, 2007.
  163. F. A. Houle, E. P. Guyer, D. C. Miller and R. H. Dauskardt, “Adhesion between template materials and UV-cured nanoimprint resists,” J. Vac. Sci. Technol. B, 25(4), 1179, 2007.
  164. K. S. Wu, M. M. Stefik, K. P. Ananthapadmanabhan and R.H. Dauskardt,  "Graded Delamination Behavior of Human Stratum Corneum,” Biomaterials, 27, 5861-5870, 2006.
  165. K. M. Flores and R. H. Dauskardt, “Mode II Fracture Behavior of a Zr-Based Bulk Metallic Glass,” Journal of the Mechanics and Physics of Solids,  54 [11], 2418 – 2435, 2006.
  166. E. P. Guyer, M. Patz, and R. H. Dauskardt, “Fracture of Nanoporous Methyl Silsesquioxane Thin-Film Glasses,” Journal of Materials Research, 21 [4], 2006.
  167. F. Iacopi, Y. Travaly, B. Eyckens, C. Waldfried, T. Abell, E.P. Guyer, D.M. Gage, R.H. Dauskardt, T. Sajavaara, K. Houthoofd, P. Grobet, P. Jacobs, K. Maex, “Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by UltraViolet radiation,” Journal of Applied Physics, 99, 053511-1 - 053511-7, 2006.
  168. B. Menzel and R. H. Dauskardt, “The Fatigue Endurance Limit of a Zr-Based Bulk Metallic Glass,” Scripta Materialia, 55, 601 - 604, 2006.
  169. P. A. Hess, B. C. Menzel, and R. H. Dauskardt, “Fatigue Damage in Bulk Metallic Glass II: Experiments,” Scripta Materialia, 54 [3], 355-361, 2006.
  170. K. K. Cameron and R. H. Dauskardt, “Fatigue Damage in Bulk Metallic Glass I: Simulation,” Scripta Materialia, 54 [3], 349-353, 2006. 
  171. B. Menzel and R. H. Dauskardt, “Stress-Life Fatigue Behavior of a Zr-Based Bulk Metallic Glass,” Acta Materialia, 54 [4], 935 - 943, 2006. 
  172. C. S. Litteken, S. Stroband, and R. H. Dauskardt, “Residual Stress Effects on Plastic Deformation and Interfacial Fracture in Thin-Film Structures,” Acta Materialia, 53 [7], 1955-1961, 2005.
  173. K. S. Wu, W.W. van Osdol, and R.H. Dauskardt.  "Mechanical Properties of Human Stratum Corneum:  Effects of Temperature, Hydration, and Chemical Treatment,” Biomaterials, 27 [5], 785-795, 2005.
  174. A. Lee, C.S. Litteken, R. H. Dauskardt and W.D. Nix, “Comparison of the Telephone Cord Delamination Method for Measuring Interfacial Adhesion with the Four-Point Bending Method,” Acta Materialia, 53, 609-616, 2005.
  175. P. A. Hess, S. J. Poon, G.J. Shiflet and R. H. Dauskardt, “Indentation Fracture Toughness of Amorphous Steel,” Journal of Materials Research, 20 [4] 783 – 786, 2005.
  176. E. P. Guyer and R. H. Dauskardt, “Effect of Solution pH on the Accelerated Cracking of Nanoporous Thin-Films Glasses,” Journal of Materials Research, 20 [3], 680 – 687, 2005.
  177. E. P. Guyer, C. Litteken, D. Maidenberg, and R. H. Dauskardt, “Reliability of Thin-Film Structures for Device Technologies:  Adhesion, New Materials and Length Scale Challenges,” Interfaces In Electronic Materials, Electrochemical Society, 2004.
  178. E. P. Guyer and R. H. Dauskardt, “Electrical Resistance Technique to Measure Crack Length in Fracture Mechanics Specimens Containing Thin-Film Structures,” Journal of Materials Research, 19 [11], 3139-3144, 2004.
  179. K. M. Flores and R. H. Dauskardt, “Fracture and Deformation of Metallic Glasses and their Composites,” Intermetallics,  12 [7-9], 1025-1029, 2004.
  180. P. A. Hess and R. H. Dauskardt, “Elevated Temperature Fatigue Crack Propagation of a Zr-Based Bulk Metallic Glass,” Acta Materialia, 52 (12), 3525-3533, 2004.
  181. E. Renuart, A.M. Fitzgerald, T.W. Kenny, and R.H. Dauskardt, “Fatigue Crack Growth in Micro-Machined Single Crystal Silicon Specimens,” Journal of Materials Research, 19 [9] 2635-2640, 2004.
  182. D. A. Maidenberg, W. Volksen, R. D. Miller, and R. H. Dauskardt, “Toughening of Nanoporous Glasses Using Porogen Residuals,” Nature Materials, published online, 27 June 2004.  In print: 3, 464 - 469, 2004.
  183. M. L. Jenkins, R. H. Dauskardt and J. C. Bravman, “Important Factors for Silane Adhesion:  Surface Coverage, Functionality, and Chain Length,” Journal of Adhesion Science and Technology, 18 (13), 1483 -1588, 2004.
  184. E. P. Guyer and R. H. Dauskardt, “Fracture of Nanoporous Thin-Film Glasses,” Nature Materials, 3, 53–57, 2004.
  185. M. B. Taub, G. Wera, R. H. Dauskardt and D. G. Mohler, “Failure of Medullary Tubes:  A Materials Analysis,” Injury, International Journal of the Care of the Injured, 35, 878 – 882, 2004.
  186. K. M. Flores, W. L. Johnson, and R. H. Dauskardt, “Fracture and Fatigue Behavior of a Zr-Ti-Nb Ductile Phase Reinforced Bulk Metallic Glass Matrix Composite,” Scripta Materialia,  49 (12) 1181-1187, 2003.
  187. D. Suh and R. H. Dauskardt, Authors’ Reply to the Comment on “Mechanical Relaxation Time Scales in a Zr-Ti-Ni-Cu-Be Bulk Metallic Glass,” Journal of Materials Research, 18 (8), 2000 – 2001, 2003.
  188. S. Stroband and R. H. Dauskardt, “Interface Separation in Residually Stressed Thin-Film Structures,” Interface Science special issue on “Mechanics of Interfaces” 11 (3), 309-317, 2003.
  189. C. S. Litteken and R. H. Dauskardt, “Adhesion of Polymer Thin-Films and Patterned Lines,” International Journal of Fracture, 119/120, 475-485, 2003.
  190. D. Suh, P. Asoka-Kumar, P. A. Sterne, R. H. Howell and R. H. Dauskardt “Temperature Dependence of Positron Annihilation in a Zr-Ti-Ni-Cu-Be Bulk Metallic Glass: Shallow versus Deep Traps,” Journal of Materials Research, 18 [9] 2021-2024, 2003.
  191. J. P. Morgan and R. H. Dauskardt, “Notch Strength Insensitivity of Self-Setting Hydroxyapatite Bone Cements,” Journal of Materials Science:  Materials in Medicine, 14, 647 – 653, 2003.
  192. D. Suh and R. H. Dauskardt, “Effects of Open-Volume Regions on Internal Times Scales and Fracture Behavior of a Zr-Ti-Ni-Cu-Be Bulk Metallic Glass,” Journal of Non-Crystalline Solids, 317 [1-2], 181 – 186, 2003.
  193. A. M. Fitzgerald,  R.H. Dauskardt, and T.W. Kenny, “Stress Wave Interference Effects during Fracture of Silicon Micromachined Specimens,” Journal of Experimental Mechanics, 43 [3] 317 – 322, 2003.
  194. P. Asoka-Kumar, R. Howell R, T.G. Nieh, P.A. Sterne, B.D. Wirth, R.H. Dauskardt, K.M Flores, D. Suh, and G.R. Odette, “Opportunities for materials characterization using high-energy positron beams,” Applied Surface Science, 194 (1-4), 160-167, 2002.
  195. D. Suh and R. H. Dauskardt, “Flow and Fracture in Zr-Based Bulk Metallic Glasses,” Annales de Chimie – Science des Matériaux, 27 [5], 25-40, 2002.
  196. D. Suh and R. H. Dauskardt, “Mechanical Relaxation Times Scales in a Zr-Ti-Ni-Cu-Be Bulk Metallic Glass,” Journal of Materials Research, 17 [6], 1254-1257, 2002.
  197. A. M. Fitzgerald,  R.S. Iyer,  R.H. Dauskardt, and T.W. Kenny, “Subcritical Crack Growth in Single Crystal Silicon using Micro-Machined Specimens,” Journal of Materials Research, 17 [3], 683-692, 2002.
  198. J. M. Snodgrass, D. Pantelidis, M. L. Jenkins, J. C. Bravman, and R. H. Dauskardt, “Subcritical Debonding of Polymer/Silica Interfaces under Monotonic and Cyclic Loading,” Acta Materialia, 50 [9], 2395-2411, 2002.
  199. D. Suh, P. Asoka-Kumar and R. H. Dauskardt, “The Effects of Hydrogen on Viscoelastic Relaxation in Zr-Ti-Ni-Cu-Be Bulk Metallic Glasses:  Implications for Hydrogen Enbrittlement,” Acta Materialia, 50 [3], 537-551, 2002.
  200. K. M. Flores, D. Suh, P. Asoka-Kumar, P.A. Sterne, R. Howell, and R. H. Dauskardt, “Characterization of Free Volume in Bulk Metallic Glass Using Positron Annihilation Spectroscopy,”  Journal of Materials Research, 17 [5], 1153-1161, 2002.
  201. S-Y. Kook and R. H. Dauskardt, “Moisture-Assisted Debonding of a Polymer/Metal Interface,” Journal of Applied Physics, 91 [3], 1293-1303,  2002.
  202. M. W. Lane, J. M. Snodgrass, and R. H. Dauskardt, “Environmental Effects on Interfacial Adhesion,” Microelectronics Reliability, 41 [9-10], 1615-1624, 2001.
  203. D. Suh and R. H. Dauskardt, “The Effects of Pre-Charged Hydrogen on the Mechanical and Thermal Behavior of Zr-Ti-Cu-Ni-Be Bulk Metallic Glass Alloys,”  Materials Transactions, JIM, 42 [4], 638-641, 2001.
  204. K. M. Flores, D. Suh, R. Howell, P. Asoka-Kumar, P.A. Sterne, and R. H. Dauskardt, “Flow and Fracture of Bulk Metallic Glass Alloys and Their Composites,”  Materials Transactions, JIM, 42 [4], 619-622, 2001.
  205. K. M. Flores and R. H. Dauskardt, "Mean Stress Effects on Flow Localization and Failure in a Bulk Metallic Glass," Acta Materialia, 49, 2527-2537, 2001.
  206. D. Suh and R. H. Dauskardt, “The Effects of Hydrogen on Deformation and Fracture of a Zr-Ti-Cu-Ni-Be Bulk Metallic Glass,” Materials Science and Engineering, A319 – 321, 480 – 483, 2001.
  207. K. M. Flores and R. H. Dauskardt, “Crack Tip Plasticity in Bulk Metallic Glass,”  Materials Science and Engineering, A319 - 321, 511 – 515, 2001.
  208. K. L. Ohashi, S. A. Yerby and R. H. Dauskardt, "Effects of an Adhesion Promoter on the Debond Resistance of a Metal-PMMA Interface," Journal of Biomedical Materials Research, 12, 419-427, 2000.
  209. R. J. Hohlfelder, D. A. Maidenberg, R. H. Dauskardt, Y. Wei, and J. W. Hutchinson, “Adhesion of Benzocyclobutine-Passivated Silicon in Epoxy Layered Structures,” Journal of Materials Research, 16 [1], 243-255, 2000.
  210. M. Lane, A. Vainchtein, H. Gao, and R. H. Dauskardt, “Plasticity Contributions to Interface Adhesion in Thin-Film Interconnect structures,” Journal of Materials Research, 15 [12], 2758-2769, 2000.
  211. K. L. Ohashi and R. H. Dauskardt, "Effects of Fatigue Loading and PMMA Precoating on the Adhesion and Subcritical Debonding of Prosthetic/PMMA Interfaces," Journal of Biomedical Materials Research, 51, 172-183, 2000.
  212. A. M. Fitzgerald, R. H. Dauskardt, and T. W. Kenny, “Fracture Toughness and Crack Growth Phenomena of Plasma-Etched Single Crystal Silicon,”  Sensors and Actuators: A, 83, 194-199, 2000.
  213. M. Lane, N. Krishna, I. Hashim, and R. H. Dauskardt, “Adhesion and Reliability of Copper Interconnects with Ta and TaN Barrier Layers,” Journal of Materials Research, 15 [1] 203-211, 2000.
  214. A. Bhatnagar, M. J. Hoffmann and R.H. Dauskardt, “Fracture and Subcritical Crack-Growth Behavior of  Y-Si-Al-O-N Glasses and Si3N4 Ceramics,” Journal of the American Ceramics Society, 83 [3] 585-596, 2000.
  215. D. Suh and R. H. Dauskardt, “Hydrogen Effects on the Mechanical and Fracture Behavior of a Zr-Ti-Cu-Ni-Be Bulk Metallic Glass,”  Scripta Materialia, 42 [3] 233-240, 2000.
  216. K. M. Flores and R. H. Dauskardt, “Enhanced Toughness Due to Stable Crack Tip Damage Zones in Bulk Metallic Glass,”  Scripta Materialia, 41 [9] 937-943, 1999.
  217. F. G. Haubensak, A. Bhatnagar, and R.H. Dauskardt, “Subcritical Growth of Microstructurally Small Cracks in Silicon Nitride Ceramics,” in Small Fatigue Cracks:  Mechanics, Mechanisms and Applications, Editors R.K.S. Ravichandran, R.O. Ritchie, and Y. Murakami, Elsevier,  pp. 271-282, 1999.
  218. K. M. Flores and R. H. Dauskardt, “Local Heating Associated with Crack Tip Plasticity in Zr-Ti-Ni-Cu-Be Bulk Amorphous Metals,” Journal of Materials Research, 14 [3] 638-643, 1999.
  219. J. Mroz, R. H. Dauskardt and U. Schleinkofer, “New Adhesion Measurement Technique for Coated Cutting Tool Materials,” International Journal of Refractory Metals and Hard Materials, 16 395-402, 1998.
  220. S-Y. Kook, J. M. Snodgrass, A. Kirtikar and R. H. Dauskardt, “Adhesion and Reliability of Polymer/Inorganic Interfaces,” Journal of Electronic Packaging,” 120 [4] 328-335, 1998.
  221. K. S. Yi, B. N. Cox and R. H. Dauskardt, "Subcritical Crack-Growth Behavior in Materials Under Cyclic Loads: Effect of Hydrodynamic Pressure Created by Viscous Environments," Journal of the Mechanics and Physics of Solids, 47 [9] 1843-1871, 1998.
  222. K. L. Ohashi, A.C. Romero, P.W. McGrowan, W.J. Maloney and R. H. Dauskardt, "Quantitative Assessment of Interface Fracture at Bone Cement/Metal Prosthetic Interfaces in Total Hip Arthroplasties," Journal of Orthopedic Research, 16 [6] 705-714, 1998.
  223. R. H. Dauskardt, M. Lane, Q. Ma, and N. Krishna, “Adhesion and Debonding of Multi-Layer Thin Film Structures,” Engineering Fracture Mechanics, 61 [1] 141-162, 1998.
  224. R. H. Dauskardt, S.-Y. Kook, A. Kirtikar and K. L. Ohashi, “Adhesion and Progressive Delamination of Polymer/Metal Interfaces,” in High Cycle Fatigue of Structural Materials, Eds. T. S. Srivatsan and W. O. Soboyejo, TMS-ASM Publication, 479-498, 1997.
  225. K. M. Flores and R. H. Dauskardt, “Fracture and Fatigue Crack-Growth Behavior of Single Crystal NiAl,”  Scripta Materialia, 36 [12] 1377-1382, 1997.
  226. S. J. Dill, S. J. Bennison and R. H. Dauskardt, “Subcritical Crack-Growth Behavior of Borosilicate Glass under Cyclic Loads:  Evidence of a Mechanical Fatigue Effect,”  Journal of the American Ceramics Society, 80 [3] 773-76, 1997.
  227. C. J. Gilbert, R. H. Dauskardt and R. O. Ritchie, "Microstructural Mechanisms of Cyclic Fatigue-Crack Propagation in Grain Bridging Ceramics," Ceramics International, 23 413-418, 1997.
  228. N. C. Nguyen, W.J. Maloney and R.H. Dauskardt, "Reliability of PMMA Bone Cement Fixation:  Fracture and Fatigue Crack-Growth Behavior," Journal of Materials Science:  Materials in Medicine, 8 [8] 473-483, 1997.
  229. E. Morgan, D. N Yetkinler, B. R Constantz,  and R. H Dauskardt, "Mechanical Properties of Carbonated Hydroxyapatite Bone Mineral Substitute: Strength, Fracture and Fatigue Behavior," Journal of Materials Science: Materials in Medicine, 8 [9] 559-570, 1997.
  230. K. S. Yi, S. J. Dill and R. H. Dauskardt, "Subcritical Crack-Growth Behavior in Glasses and Ceramics:  Effect of Hydrodynamic Pressures in Aqueous Environments," Acta Metallurgica et Materialia, 45 [7] 2671-2684, 1997.
  231. R. H. Dauskardt and J. W. Ager, "Quantitative Stress Mapping in Alumina Composites by Optical Fluorescence Imaging," Acta Metallurgica et Materialia, 44, [2] 625-641, 1996.
  232. M. J. Hoffman, Y. W. Mai, R. H. Dauskardt, J. Ager, and R. O. Ritchie, "Grain Size Effects on Cyclic Fatigue and Crack-Growth Resistance Behavior of Partially Stabilized Zirconia," Journal of Materials Science, 30 3291-99, 1995.
  233. M. D. Drory, R. H. Dauskardt, A. Kant and R. O. Ritchie, "Fracture of Synthetic Diamond,"  Journal of Applied Physics, 78 (5) 3083-88, 1995.
  234. C. J. Gilbert, R. H. Dauskardt, and R. O. Ritchie, "Behavior of Cyclic Fatigue Cracks in Monolithic Silicon Nitride," Journal of the American Ceramics Society, 78 [9] 2291-300, 1995.
  235. R. H. Dauskardt, R. O. Ritchie, J. K. Takemoto and A. M. Brendzel, Reply to Discussion of Lankford and Sines on "Cyclic Fatigue and Fracture in Pyrolytic Carbon-Coated Graphite Mechanical Heart-Valve Prostheses: Role of Small Cracks in Life Prediction," Journal of Biomechanical Materials Research, 29, [5] 676-678, 1995.
  236. R. O. Ritchie, R. M. Cannon, B. J. Dalgleish, R. H. Dauskardt and J. M. McNaney, "Prediction of Crack Paths at, or Nearly Parallel to, Ceramic-Metal Interfaces," Scripta Metallurgica et Materialia, 28, 1995. In press.
  237. C. D. Bencher, R. H. Dauskardt, and R. O. Ritchie, "Microstructural Damage and Fracture Processes in a Composite Solid Rocket Propellant," Journal of Spacecrafts and Rockets, 32 [2] 328-34, 1995.
  238. C. J. Gilbert, R. N. Petrany, R. H. Dauskardt, R. W. Steinbrech, and R. O. Ritchie, "Cyclic Fatigue in Monolithic Alumina: Mechanisms for Crack Advance Promoted by Frictional Wear of Grain Bridges," Journal of Materials Science, 30 643-54, 1995.
  239. R. O. Ritchie, R.H. Dauskardt, K.T. Venkateswara Rao, “Fatigue-Crack Propagation Behavior in Monolithic and Composite Ceramics and Intermetallics,” Materials Science, May-June, 30 [3], 277-300, 1994.
  240. R. O. Ritchie, and R. H. Dauskardt, "Cyclic Fatigue of Ceramics," in Encyclopedia of Advanced Materials, D. Bloor, R. J. Brook, M. C. Flemmings, and S. Mahajan, eds., Pergamon Press, Oxford, U.K., vol. 2, 791-798, 1994.
  241. B. E. Cornelissen, R. H. Dauskardt,  R. O. Ritchie, and G. Thomas, "Cyclic Fatigue Behavior and Fracture Toughness of Silicon Nitride Sintered With Rare-Earth Oxides," Acta Metallurgica et Materialia, 42 [9] 3055-3064, 1994.
  242. R. H. Dauskardt, "Cyclic Fatigue-Crack Growth in Si3N4 Ceramics," in Tailoring of High Temperature Properties of Si3N4 Ceramics, eds. M. J. Hoffmann and G. Petzow, Kluwer Academic Publishers, Dordrecht, The Netherlands, 365-378, 1994.
  243. C. J. Gilbert, J. M. McNaney, R. H. Dauskardt and R. O. Ritchie, "Back-Face Strain Compliance and Electrical-Potential Crack Length Calibrations for the Disk-Shaped Compact-Tension DC(T) Specimen," Journal of Testing and Evaluation, [3] 117-120, 1994.
  244. R. M. Cannon, B. J. Dalgleish, R. H. Dauskardt, J. M. McNaney and R. O. Ritchie, "Crack Path and Fracture Energies in Ceramic-Metal Sandwich Geometries," Journal of the American Ceramic Society, 76, 1994. In press.
  245. R. H. Dauskardt, R. O. Ritchie, J. K. Takemoto and A. M. Brendzel, "Cyclic Fatigue and Fracture in Pyrolytic Carbon-Coated Graphite Mechanical Heart-Valve Prostheses: Role of Small Cracks in Life Prediction," Journal of Biomechanical Materials Research, 28, 791-804, 1994.
  246. R. O. Ritchie, R. M. Cannon, B. J. Dalgleish, R. H. Dauskardt and J. M. McNaney, "Mechanics and Mechanisms of Crack Growth at or near Ceramic-Metal Interfaces: Interface Engineering Strategies for Promoting Toughness," Materials Science and Engineering A, A166, 221-235, 1993.
  247. R. H. Dauskardt, "A Frictional-Wear Mechanism For Fatigue-Crack Growth in Grain Bridging Ceramics," Acta Metallurgica et Materialia, 41, [9] 2765-2781, 1993.
  248. R. H. Dauskardt, "Cyclic Fatigue-Crack Growth in Grain Bridging Ceramics," Journal of Engineering Materials and Technology, 115, 244-251, 1993.
  249. R. H. Dauskardt, R. O. Ritchie and B. N. Cox, "Fatigue of Advanced Materials: Part II," Advanced Materials and Processes, 144, [8] 30-35, 1993.
  250. R. H. Dauskardt, R. O. Ritchie and B. N. Cox, "Fatigue of Advanced Materials: Part I," Advanced Materials and Processes, 144, [7] 26-31, 1993.
  251. R. H. Dauskardt, B. J. Dalgleish, D. Yao, R. O. Ritchie and P. F. Becher, "Cyclic Fatigue-Crack Propagation in a Silicon Carbide Whisker-Reinforced Alumina Composite: Role of Load Ratio," Journal of Materials Science, 28, 3258-3266, 1993.
  252. C. Sheu, R. H. Dauskardt and L. C. De Jonghe, "Effect of Encapsulation Processing on Toughness and Crack Growth Behavior of Silicon Carbide/Polymethacrylate Particulate Composites," Journal of Material Science, 28, 2196-2206, 1993.
  253. A. A. Steffen, R. H. Dauskardt and R. O. Ritchie, "Small-Crack Behavior and Safety Critical Design Criteria for Cyclic Fatigue in Mg-PSZ," in Cyclic Deformation, Fracture and Non-Destructive Evaluation of Advanced Materials, ASTM STP 1157, M. R. Mitchell and O. Buck, eds., American Society for Testing and Materials, Philadelphia, PA, pp. 69-81, 1992.
  254. R. H. Dauskardt, M. R. James, J. R. Porter and R. O. Ritchie, "Cyclic Fatigue-Crack Growth in SiC-Whisker-Reinforced Alumina Composite:  Long and Small-Crack Behavior," Journal of the American Ceramic Society, 75,  759-71, 1992.
  255. R. O. Ritchie, R. H. Dauskardt and F. J. Pennisi, "On the Fractography of Overload, Stress Corrosion and Cyclic Fatigue Failures in Pyrolytic-Carbon Materials used in Prosthetic Heart-Valve Devices," Journal of Biomedical Materials Research, 26, 69-76, 1992. 
  256. R. M. Cannon, B. J. Dalgleish, R. H. Dauskardt, T. S. Oh and R. O. Ritchie, "Cyclic Fatigue-Crack Propagation along Ceramic/Metal Interfaces," Acta Metallurgica et Materialia, 39 [9] 2145-2156, 1991.
  257. R. O. Ritchie and R. H. Dauskardt, "Cyclic Fatigue of Ceramics: A Fracture Mechanics Approach to Subcritical Crack Growth and Life Prediction," Journal of the Ceramic Society of Japan, 99, [10] 1047-1062, 1991.
  258. A. A. Steffen, R. H. Dauskardt and R. O. Ritchie, "Cyclic Fatigue Life and Crack- Growth Behavior of Microstructurally-Small Cracks in Mg-PSZ Ceramics," Journal of the American Ceramic Society, 74 [6] 1259-68, 1991.
  259. R. H. Dauskardt, C. Carter, D. K. Veirs and R. O. Ritchie, "Transient Subcritical Crack-Growth Behavior in Transformation-Toughened Ceramics," Acta Metallurgica et Materialia, 38 [11] 2327-336, 1990.
  260. D. B. Marshall, M. C. Shaw, R. H. Dauskardt, R. O. Ritchie, M. Readey and A. H. Heuer, "Crack Tip Transformation Zones in  Toughened Zirconia," Journal of the American Ceramics Society, 73 [9] 2659-666, 1990.
  261. E. Y. Luh, R. H. Dauskardt and R. O. Ritchie, "Cyclic Fatigue-Crack Growth Behavior of Short Cracks in SiC- Reinforced LAS Glass-Ceramic Composites," Journal of Materials Science Letters, 9, 719-725, 1990.
  262. R. O. Ritchie, R. H. Dauskardt, W. Yu and A. M. Brendzel, "Cyclic Fatigue-Crack Propagation, Stress-Corrosion and Fracture-Toughness Behavior in Pyrolytic Carbon-Coated Graphite For Prosthetic Heart Valve Applications," Journal of Biomedical Materials Research, 24 [2] 189-206, 1990.
  263. R. H. Dauskardt, D. B. Marshal and R. O. Ritchie, "Cyclic Fatigue-Crack Propagation in Mg-PSZ Ceramics," Journal of the American Ceramics Society, 73 [4] 893-903, 1990.
  264. R. H. Dauskardt, F. Haubensak, and R. O. Ritchie, "On The Interpretation of The Fractal Character of Fracture Surfaces," Acta Metallurgica et Materialia, 38 [2] 143-59, 1990.
  265. R. H. Dauskardt and R. O. Ritchie, "Cyclic Fatigue-Crack Growth Behavior in Ceramics," Closed Loop, 17 [2]  7-17, 1989. 
  266. R. H. Dauskardt, D. K. Veirs and R. O. Ritchie, "Application of Spatially Resolved Raman Spectroscopy in the Study of Transformation Zones in PSZ," Journal of the American Ceramics Society, 72 [7] 1124-30, 1989.
  267. P. N. Spencer, R. H. Dauskardt, E. R. Parker and R. O. Ritchie, "Fracture-Toughness, Fatigue-Crack Propagation and Creep-Rupture Behavior in Thick-Section Weldments of 3Cr-Mo Pressure-Vessel Steels Developed for High-Temperature/High-Pressure Hydrogen Service," High Temperature Technology, 8 [2] 17-26, 1988.
  268. R. H. Dauskardt, W. Yu and R. O. Ritchie, "Fatigue Crack Propagation in Transformation-Toughened Zirconia Ceramic," Journal of the American Ceramics Society, 70 [10] C-248 - C-252, 1987.
  269. R. H. Dauskardt, R. D. Pendse and R. O. Ritchie, "Effects of Pre-Existing Grain Boundary Microvoid Distributions on Crack Growth under Monotonic and Cyclic Loading," Acta Metallurgica et Materialia, 35 [9] 2227-42, 1987.
  270. O. F. R. A. Damm, R. H. Dauskardt and G. G. Garrett, "Laboratory-Scale Semi-Continuous Casting of Aluminum Alloys," Metals and Materials, 2 [9] 565-6, 1986.

Patents

  1. US Patent Application 15/874527 “Method for forming perovskite layers using atmospheric pressure plasma,” Florian Hilt, Michael Q. Hovish, Nicholas Rolston, Reinhold H. Dauskardt, Filed January, 2018.
  2. U.S. Patent Number: 9,889,046, “Skin Treatment Devices and Methods with Pre-Stressed Configurations,” Geoffrey C. Gurtner, Reinhold H. Dauskardt, Michael T. Longaker, Paul Yock, issued February 13, 2018.
  3. US Provisional Patent Application for “Lens array for the patterning of photoresist by maskless lithography,” Nicholas J. Rolston, Adam Printz, Stephen Hamann, Olav Solgaard, and Reinhold H. Dauskardt, February 2018.
  4. US Provisional Application 62/479773 “Mechanical Scaffolds for Enhancing the Thermomechanical and Chemical Reliability of Thin Film (Perovskite) Device Technologies,” Adam Printz, Nicholas Rolston, Brian L. Watson, Reinhold H. Dauskardt, March 31, 2017.
  5. US Provisional Application 62/479803 “Synthesis and Use of Azide-Functionalized Nodes for Cross-linking Materials Containing Organic Components,” Brian L. Watson, Nicholas Rolston, Reinhold H. Dauskardt, March 31, 2017.
  6. US Patent Application.  Graded Index Lens as a Nontracking Solar Concentrator.  Filed 2010.
  7. US Patent Application.  Devices and Methods for Wound Treatment Applicator.  Filed August 2009.
  8. US Patent Application 20080033334.  Devices and Bandages for the Treatment or Prevention of Scars and/or Keloids and Methods and Kits Thereof.  Filed June 2006.
  9. US Patent Application 05749678.8-2310-US2005015498.  Methods for Gastric Volume Control.  Issued 2005.

Refereed Conference Proceedings

  1. Karsu I. Kilic and Reinhold H. Dauskardt, “Nonaffine Deformations in ULK Dielectric Glasses,” IEEE International Interconnect Technology Conference / Advanced Metallization Conference, Santa Clara, CA, 2018.
  2. Nicholas Rolston, Adam D. Printz, Florian Hilt, Michael Q. Hovish, Karsten Brüning, Christopher J. Tassone, Reinhold H. Dauskardt, “Spray Plasma Processing of Barrier Films Deposited in Air for Improved Stability of Flexible Electronic Devices,” IEEE-IITC, Santa Clara, CA, 2018.
  3. Nicholas Rolston, Adam D. Printz, Jared M. Tracy, and Reinhold H. Dauskardt, “Effect of Composition and Microstructure on the Mechanical Stability of Perovskite Solar Cells”, World Conference on Photovoltaic Energy Conversion (WCPEC-7), Waikoloa, Hawaii, 2018.
  4. Nick Bosco, Jared Tracy and Reinhold Dauskardt, “Environmental Influence on Module Delamination Rate,” World Conference on Photovoltaic Energy Conversion (WCPEC-7), Waikoloa, Hawaii, 2018.
  5. S. G. Prolongo, N. Rolston, A. Printz, B. Watson, and R. H. Dauskardt, “Manufacture and characterization of transparent conductor polymer coatings doped with graphitic nanofillers for optoelectronic devices,” VIII ECCOMAS Thematic Conference on Smart Structures and Materials, SMART 2017, Madrid, Spain, June 2017.
  6. Nick Bosco, Jared Tracy, Reinhold Dauskardt and Sarah Kurtz, “Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability,” 2017 IEEE 44th PVSC, June 2017.
  7. Jared Tracy, Nick Bosco, and Reinhold Dauskardt, “Evaluation of Encapsulant Adhesion to Surface Metallization of Photovoltaic Cells,” 2017 IEEE 44th PVSC, Washington, DC, June 2017. 
  8. Nick Bosco, Sarah Kurtz, Jared Tracy and Reinhold H. Dauskardt, “Defining Threshold Values of Encapsulant and Backsheet Adhesion for PV Module Reliability, IEEE PVSC Conference, Washington, DC. 2017.
  9. Nick Bosco, Jared Tracy, Reinhold Dauskardt and Sarah Kurtz, “Development and First Results of the Width-tapered Beam Method for Adhesion Testing of Photovoltaic Material Systems,” 2016 IEEE 43rd PVSC, 5 June 2016. 
  10. Jacob R. Bow, Szilvia Mesaros, Rainer Voegeli, Anthony V. Rawlings, and Reinhold H. Dauskardt, “Biomechanical Impact of Vitamin Species on Human Stratum Corneum,” International Federation of Societies of Cosmetic Chemists, Oct 2016, Orlando, FL.
  11. Can Cai, David C. Miller, Ian A. Tappan, Reinhold H. Dauskardt. "Degradation of Silicone Encapsulants in CPV Optics." IEEE PVSC, June 6, 2016. Portland, OR.
  12. Ryan Brock, David C. Miller, Reinhold H. Dauskardt, “Adhesion of Antireflective Coatings in Multijunction Photovoltaics,” IEEE PVSC. June 7, 2016 Portland OR.
  13. Joseph A. Burg, Reinhold H. Dauskardt, “Thermomechanical Asymmetries in ULK Dielectric Glasses,” IEEE International Interconnect Technology Conference / Advanced Metallization Conference, San Jose, CA, May 2016.
  14. Qiran Xiao, Brian Watson, Reinhold H. Dauskardt, “Low-Cost, Single-Step Hybrid Bond/Barrier Films for Cu Bondlines in Advanced Packaging,” IEEE International Interconnect Technology Conference Proceedings, Grenoble, France, May 2015.
  15. H. Duplan, et. al.  “Skin hydration: how mechanical properties and molecular aspects of the stratum corneum inform us for the management of dry skin?” International Federation of Societies of Cosmetic Chemists, Oct 2014, Paris France.
  16. Stephanie R. Dupont, Chris Bruner, Reinhold H. Dauskardt, “Controlling the Reliability of Polymer Solar Cells,” 40th IEEE Photovoltaic Specialists Conference, Denver, CO, June 2014.
  17. Ryan E; Iacopi, Francesca; Iacopi, Alan Victor; Hold, Leonie Katharina; Dauskardt, Reinhold, “Highly compressed nano-layers in epitaxial silicon carbide membranes for MEMs sensors,” 2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014.
  18. Marta Giachino, Florencia Paredes, Nisha Ananthakrishnan, Shawna M. Liff, and Reinhold H. Dauskardt, “Moisture-Assisted Failure Mechanisms in Underfill Epoxy/Silicon Systems for Microelectronic Packaging,” IEEE International Interconnect Technology Conference Proceedings, San Jose, CA, June 2014.
  19. Ryan E.  Brock, Francesca Iacopi, Alan Iacopi, Leonie Hold, Reinhold H.  Dauskardt, “Highly Compressed Nano-Layers in Epitaxial Silicon Carbide Membranes for MEMs Sensors,” IEEE International Interconnect Technology Conference Proceedings, San Jose, CA, June 2014.
  20. Florencia Paredes, Marta Giachino, Nisha Ananthakrishnan, Shawna M. Liff and Reinhold H. Dauskardt, “Moisture Resistant Hybrid Layer for High-Performance Adhesion,” 2012 TECHCON, Austin, Texas, 2012.
  21. Stephanie R. Dupont, Eszter Voroshazi, Paul Heremans, Reinhold H. Dauskardt, "The effect of anneal, solar irradiation and humidity on the adhesion/cohesion properties of P3HT:PCBM based inverted polymer solar cells," 38th IEEE Photovoltaic Specialists Conference, 3259-3262, Austin Convention Center, Austin, Texas, June 3-8, 2012.
  22. Alexander Hsing, Holm Geisler, Vivian Ryan, Ming Cheng, Kashi Machani, Dirk Breuer, Matthias U. Lehr, Jens Paul, Francesca Iacopi, and Reinhold Dauskardt, "Microprobing the Mechanical Effects of Varying Dielectric Porosity in Advanced Interconnect Structures," IEEE International Interconnect Technology Conference Proceedings, June 2012.
  23. Yusuke Matsuda, Sean W. King, Geraud Dubois, Jeff Bielefeld, Jitendra Rathore, Leonard Interrante, Reinhold H. Dauskardt, “New classes of ULK dielectrics with superior thermomechanical properties,” Advanced Metallization Conference, San Diego, 2011.
  24. Alexander Hsing, Holm Geisler, Vivian Ryan, Francesca Iacopi, Ming Cheng, Matthias U. Lehr, Jens Paul, Kashi Machani­­, Paul Besser, and Reinhold Dauskardt, "Shear Microprobing the Mechanical Effects Varying Dielectric Porosity in Advanced Interconnect Structures, IEEE International Interconnect Technology Conference Proceedings, June 2011.
  25. N. Vaidya, R.H. Dauskardt and O. Solgaard, “Axially Graded Index LEns as a non-tracking solar concentrator,” SOLAR OSA (Optics for Solar Energy) Conference, 2011.
  26. Marta Giachino, Taek-Soo Kim, Gillian V. Lui, Nisha Ananthakrishnan Shawna M. Liff, and Reinhold H. Dauskardt, " Functionally Graded Hybrid Glass Layers for High-Performance Polymer/Silicon Adhesion," 2011 TECHCON, 2011.
  27. A. W. Hsing, A. V. Kearney, L. Li, J. Xue, M. Brillhart and R. H. Dauskardt, “Shear Microprobing of Chip-Package Interaction in Advanced Interconnect Structures,” IEEE International Interconnect Technology Conference Proceedings, June 2011.
  28. Yusuke Matsuda, Sean W. King, Jeff Bielefeld, Reinhold H. Dauskardt, “High toughness and moisture insensitive hydrogenated amorphous silicon carbide films for MEMS/NEMS,” ECS Transactions, 33 (8), 257-261, 2010.
  29. Mark Oliver, Geraud Dubois, Reinhold Dauskardt, “Molecular Design of Ultra-Low-k Hybrid Glasses,” IEEE International Interconnect Technology Conference Proceedings, June 2010.  Winner of the 2010 IITC S.C. Sun Best Student Paper Award.
  30. Yusuke Matsuda, Sean W. King, Jeff Bielefeld and Reinhold H. Dauskardt, “Mechanical Properties of Hydrogenated Amorphous Silicon Carbide Thin Films,” IEEE International Interconnect Technology Conference Proceedings, June 2010.
  31. A. W. Hsing, A. V. Kearney, L. Li, J. Xue, M. Brillhart and R. H. Dauskardt, “Microprobing the Mechanics of Complex Interconnect Structures,” IEEE International Interconnect Technology Conference Proceedings, June 2010.
  32. J. Yang, M.S. Oliver, R.H. Dauskardt, “Optimized Adhesive Bonding to  Bulk Metallic Glass Substrates” SAMPE 2010, Seattle, WA, 2010.
  33. M. S. Oliver, R.H. Dauskardt, “Crack Growth Mechanisms in Sol-Gel Adhesive Coupling Layers” SAMPE 2010, Seattle, WA, 2010
  34. Ryan Birringer, Roey Shaviv, Tom Mountsier, Jon Reid, Jian Zhou, Roy H. Geiss, David Read, and Reinhold Dauskardt, "Adhesion, Cu Voiding, and Debonding Kinetics of Copper / Dielectric Diffusion Barrier Films,” Advanced Metallization Conference, Baltimore, 2009.
  35. Taek-Soo Kim, Naoto Tsuji, Johan van der Hilst, Kiyohiro Matsushita Nobuyoshi Kobayashi, Dmytro Chumakov, Holm Geisler, Ehrenfried Zschech and Reinhold H. Dauskardt, “Tuning Depth Profiles of Low-k Dielectrics with UV Curing,” Advanced Metallization Conference, 337-340, San Diego, CA, 2008.
  36. Ryan Birringer, Roey Shaviv and Reinhold H. Dauskardt, “Effects of Current Density, Environments and Temperature on Adhesion and Debonding Kinetics of Cu / Barrier Interfaces,” Advanced Metallization Conference, 331-336, San Diego, CA, 2008.
  37. Taek-Soo Kim, Tomohisa Konno, Tatsuya Yamanaka, and Reinhold H. Dauskardt, “Optimizing CMP for Ultra-Low-k Dielectrics,” 13th International Chemical Mechanical Planarization Conference for ULSI Multilevel Interconnection, Freemont, CA, 2008.
  38. Mark S. Oliver, Kay Y. Blohowiak, Reinhold H. Dauskardt, “Reliability of Adhesive Interphases for Titanium-Graphite Laminates,” SAMPE 2008, Los Angeles, CA, 2008.
  39. Taek-Soo Kim, Qiping Zhong, Maria Peterson, Halbert Tam, Tomohisa Konno, and Reinhold H. Dauskardt, “Stress and Slurry Chemistry Effects on CMP Damage of Ultra-Low-k Dielectrics,” IEEE International Interconnect Technology Conference Proceedings, June 2007.
  40. Andrew V. Kearney, Anand V. Vairagar, Holm Geisler, Ehrenfried Zschech, and Reinhold H. Dauskardt, “Assessing the Effect of Die Sealing in Cu/Low-k Structures,” IEEE International Interconnect Technology Conference Proceedings, June 2007.
  41. Markus D. Ong and Reinhold H. Dauskardt, “A Novel Bonding Technique Using Metal-Induced Crystallization of Amorphous Silicon,” Mater. Res. Soc. Symp. Proc., Warrendale, PA, 2007.
  42. Markus D. Ong, Vincent Jousseaume, Sylvain Maitrejean, Reinhold H. Dauskardt: "Fracture Properties of Porous MSSQ Films: Impact of Porogen Loading and Burnout, in Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects, edited by Ting Y. Tsui, Young-Chang Joo, Lynne Michaelson, Michael Lane, Alex A. Volinsky (Mater. Res. Soc. Symp. Proc. 914, Warrendale, PA, 2006), 0914-F04-07.
  43. Reinhold H. Dauskardt, Taek-Soo Kim, Qiping Zhong, Maria Peterson, Halbert Tam, and Tomohisa Konno, “Stress and Slurry Chemistry Effects on Cracking and Damage Evolution during CMP: Implications for Next Technology Nodes,” Twelfth International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection (CMP-MIC), Fremont, California, 2006.
  44. Taek-Soo Kim, Qiping Zhong, Maria Peterson, Halbert Tam, Tomohisa Konno and Reinhold H. Dauskardt, “Effects of Nonionic Surfactants on the Fracture of Nanoporous Methylsilsesquioxane Thin-Film Glasses,”  International Conference of Planarization/CMP Technology, Foster City, CA, October 2006.
  45. Andrew V. Kearney, Heitor Chang, Michael E. Mills, and Reinhold H. Dauskardt, “Influence of Porosity and Film Thickness on Adhesion of Nanoporous Organic Dielectrics,” proceedings of the Advanced Metallization Conference, pp. 517-520, San Diego, CA, 2006.
  46. Taek-Soo Kim, N. Tsuji, N. Kemeling, K. Matsushita, and R. H. Dauskardt, “Non-Uniform UV Curing Effects on Mechanical and Fracture Properties of Organosilicate Low-k Thin Films,” proceedings of the Advanced Metallization Conference, pp. 389-394, San Diego, CA, 2006.
  47. D. M. Gage, J. F. Stebbins, and R. H. Dauskardt, “Effect of UV Cure on Adhesive and Cohesive Failure of Low-k Films: Implications for Integration,” proceedings of the Advanced Metallization Conference, pp. 327-330, San Diego, CA, 2006.
  48. F. A. Houle, E. Guyerb, D. C. Millera, R. H. Dauskardt, E. Rice and J. Hamilton, “Adhesion between template materials and UV-cured nanoimprint resists,” proceedings of the 2006 SPIE Conference, Sana Clara, CA, 2006.
  49. B. M. Sharratt and R. H. Dauskardt, “The Role of Nanoscale Confinement of Adhesion Promoting Molecules on the Adhesion and Resistance to Moisture Attack at the Polymer/Silicon Nitride Interface,” Materials Research Society Symposium Proceedings, Symposium Z: Mechanics of Nanoscale Materials and Devices, MRS Spring Meeting, San Francisco, CA, 17-21 April 2006.
  50. Andrew V. Kearney, Reinhold H. Dauskardt, Carol E. Mohler, Michael E. Mills, "Unusual Fracture Behavior of Nanoporous Polymeric Thin-Films", in Mechanical Properties of Nanostructured Materials - Experiments and Modeling, edited by J.G. Swadener, E. Lilleodden, S. Asif, D. Bahr, and D. Weygand (Mater. Res. Soc. Symp. Proc. 880E, Warrendale, PA, 2005), BB8.9.
  51. Z. Cui, G. Dixit, Li-Qun Xia, A. Demos, B. H. Kim, D. Witty, H. M’saad, and R. H. Dauskardt, “Benchmarking Four Point Bend Adhesion Testing: The Effect of Test Parameters On Adhesion Energy,” 2005 International Conference on Characterization and Metrology for ULSI Technology, NIST conference, 2005.
  52. B. M. Sharratt, L.C. Wang, and R.H. Dauskardt, “Effect of interface chemistry and thermomechanical loading on debonding of polymer/silicon interfaces: Implications for device reliability.” In 2005 TECHCON On-line Proceedings, 2005. *Best Paper in Session.
  53. D. M. Gage, K. Kim, C. S. Litteken, and R. H. Dauskardt, “Effects of Friction and Loading Parameters on Four-Point Bend Adhesion Measurements of Low-k Thin Film Interconnect Structures,” IEEE International Interconnect Technology Conference Proceedings, June 2005.
  54. E. P. Guyer and R. H. Dauskardt, “Accelerated Crack Growth of Nanoporous Low-k Glasses in Aqueous Solutions,” proceedings of the Annual Meeting of the Electrochemical Society, Hawaii, 2004.
  55. B. Sharratt and R. H. Dauskardt, “Fatigue Loading Effects on Underfull/Passivation Interface Reliability for High Density Packaging,” proceedings of the 37th International Symposium on Microelectronics (IMAPS), Long Beach, CA, p. 1083 – 1090,  2004.
  56. B. M. Sharratt and R.H. Dauskardt, “Debonding under fatigue loading at polymer/inorganic interfaces.” In 2004 Materials Research Society Conference Proceedings, 821, 2004, p. 363-368.
  57. P. A. Hess, B. Menzel and R. H. Dauskardt, “Mechanisms of Fatigue Damage Formation and Evolution in Zr-Based Bulk Metallic Glass,” proceedings of the 11th International Conference of Fracture, Turin, Italy, March, 2005.
  58. E. P. Guyer and R. H. Dauskardt, “Accelerated Debonding and Cracking in Thin-Film Structures:  Chemical Reaction Rate and Loading Effects,” proceedings of the 11th International Conference of Fracture, Turin, Italy, March, 2005.
  59. C. Litteken and R. H. Dauskardt, “Fracture in Thin-Film Structures for Device Technologies:  New Material and Length Scale Challenges,” proceedings of the 11th International Conference of Fracture, Turin, Italy, March, 2005.
  60. E. P. Guyer, R. H. Dauskardt, Effect of CMP Slurry Environments on Subcritical Crack Growth in Ultra Low-k Dielectric Materials, IEEE International Interconnect Technology Conference Proceedings, June 2003.
  61. E. P. Guyer and R. H. Dauskardt, Accelerated Crack Growth of Nanoporous Low-k Glasses in CMP Slurry Environments, IEEE International Interconnect Technology Conference Proceedings, to be published in June 2004.
  62. E. P. Guyer and R. H. Dauskardt, “Effect of Aqueous Solution Chemistry on the Accelerated Cracking of Lithographically Patterned Arrays of Copper and Nanoporous Thin-Films,” MRS Symposium Proceedings Materials Research Society, Warrendale, PA. 2004.
  63. K. M. Flores and R. H. Dauskardt, “Fracture and Deformation of Bulk Metallic Glasses and their Composites,” Proceedings of the TMS Annual Meeting, to be published in Intermetallics, San Diego, March 2003.
  64. L. C. Wang and R. H. Dauskardt, "Effect of Moisture and Graded-Layer Mechanical Properties on Deformation and Interfacial Adhesion,"  NanoStructured Materials, Mater. Res. Soc. Proc. Warrendale, PA, 2003.
  65. S. Stroband and R. H. Dauskardt, “Multi-Scale Simulations Of Interfacial Fracture Of Nanoscale Thin-Film Structures: Effect Of Length Scales and Residual Stresses,” MRS Symposium Proceedings Materials Research Society, Warrendale, PA. 2003.
  66. C. Litteken, R. Dauskardt, T. Scherban, G. Xu, J. Leu, D. Gracias and B. Sun, “Interfacial Adhesion of Thin-Film Patterned Interconnect Structures,” Proceedings of the International Interconnects and Technology Conference, San Francisco, CA, 2003.
  67. E. P. Guyer and R. H. Dauskardt, “Effect of CMP Slurry Environments on Subcritical Crack Growth in Ultra Low-k Dielectric Materials,” Proceedings of the International Interconnects and Technology Conference, IEEE, pgs. 89-91, San Francisco, CA, 2003.
  68. D. A. Maidenberg, W. Volksen, R. D. Miller, and R. H. Dauskardt, “Effects of Templating Byproducts on Adhesion of Nanoporous Dielectric Films,” Proceedings of the International Interconnects and Technology Conference, San Francisco, CA, 2003.
  69. P. A. Hess and R.H. Dauskardt, “Elevated Temperature Fatigue Crack Propagation of a Zr-Ti-Cu-Ni-Be Bulk Metallic Glass,” in Supercooled Liquids, Glass Transition, and Bulk Metallic Glass, edited by T. Egami, A.L. Greer, A. Inoue, and S. Ranganathan (Mat. Res. Soc. 754, Boston, MA, 2002), p. 237-242.
  70. K. Nagarajan and R.H. Dauskardt, “Adhesion and reliability of underfill/subtrate interfaces in flip chip BGA packages: metrology and characterization,” SEMICON West, Electronics Manufacturing Technology Symposium, IEEE, 206-214, 2002.
  71. D. Suh and R. H. Dauskardt, “The Effect of Atomic-Scale Open-Volume on Flow and Fracture Processes in a  Zr-Ti-Ni-Cu-Be Bulk Metallic Glass,” Proceedings of the Fall MRS Meeting, Boston, MA, 2002.
  72. D. A. Maidenberg, W. Volksen, R. D. Miller, and R. H. Dauskardt, “Adhesion and Reliability of Methylsilsesquioxane Dielectric Materials,” Proceedings of the 7th International Conference on Polymers in Electronic Packaging, H.S. Sachdev, M.M. Khojasteh, and D. McHerron, eds., held in McAfee, NJ, Oct. 18-20, 2000,  301 – 309, Society of Plastics Engineers, Hopewell Junction, NY, 2002.
  73. D. Suh and R. H. Dauskardt, “Interactions of Hydrogen with Amorphous Nano-Structure and Their Effects on Relaxation Behavior of Zr-Ti-Ni-Cu-Be Bulk Metallic Glass,” International Conference On Hydrogen Effects on Material Behavior and Corrosion Deformation Interactions, Jackson Lake Lodge Moran, Wyoming September 22, 2002.
  74. K. S. Wu, W.W. van Osdol, and R.H. Dauskardt.  "Mechanical and Microstructural Properties of Stratum Corneum."  Biological and Biomimetic Materials -- Properties to Function, edited by J. McKittrick, J. Aizenberg, C. Orme, and P. Vekilov, Mater. Res. Soc. Proc. 724, Warrendale, PA, 2002, pp. N2.7.1-N2.7.7.
  75. M. Jenkins, J. Snodgrass, A. Chesterman, G. DeVries, R.H. Dauskardt, and J.C. Bravman. "Adhesion Mechanisms of Silane Adhesion Promoters in Microelectronic Packaging." MRS Symposium Proceedings Volume 682E. Materials Research Society, Warrendale, PA. 2001. N6.4.
  76. M. Jenkins, G.A. DeVries, R.H. Dauskardt, and J. C. Bravman. "Studies of Silane Adhesion Promoters on Silica Filler Particles for use in Microelectronic Packaging." MRS Symposium Proceedings Volume 710. Materials Research Society, Warrendale, PA. 2001. DD10.10.
  77. E. Renuart, A.M. Fitzgerald, T.W. Kenny, and R.H. Dauskardt, “Fatigue Processes in Single Crystal Silicon MEMS Devices,” Proceedings of the Spring MRS Meeting, San Francisco, 2001.
  78. L. Wang and R. H. Dauskardt, “Effect of Composition and Bead Settling on Debonding of Underfill Layers,”  Proceedings of the Spring MRS Meeting, Vol. 682E, pp. N.1.7.1 – N.1.7.6, San Francisco, 2002.
  79. M. Taub and R. H. Dauskardt, “Adhesion and Debonding of Pressure Sensitive Adhesives Used in Transdermal Drug Delivery Systems,” Proceedings of the 24thAnnual Meeting of the Adhesion Society, pp. 141 – 143, February 25-28, 2001 (Williamsburg, VA, USA).
  80. V. Jew, J. P. Morgan and R. H. Dauskardt, “Strength, Toughness and Fatigue of an Apatite Cement,” in Orthopaedic/Dental Biomaterials, Proceedings of the Fall MRS Meeting, pp. LL3.5.1 - LL3.5.6, Boston, 2000.
  81. M. Taub and R. H. Dauskardt, “Adhesion of Pressure Sensitive Adhesives with Application in Transdermal Drug Delivery,” in Biomaterials for Drug Delivery and Tissue Engineering, Proceedings of the Fall MRS Meeting, Boston, v. 662, pp. NN4.9.1 – NN4.9.6, 2000.
  82. P. A. Sterne, P. Asoka-Kumar, J. H. Hartley, R. H. Howell, T.G. Nieh, K. M. Flores, D. Suh, and R. H. Dauskardt, “Short Range Chemical Ordering in Bulk Metallic Glasses,” in Supercooled Liquid, Bulk Glassy, and Nanocrystalline States of Alloys, Proceedings of the Fall MRS Meeting, Boston, pp. L1.3.1 – L1.3.6, 2000.
  83. D. Suh and R. H. Dauskardt, “Hydrogen Embrittlement in a Zr-Ti-Cu-Ni-Be Bulk Metallic Glass,” in Supercooled Liquid, Bulk Glassy, and Nanocrystalline States of Alloys, Proceedings of the Fall MRS Meeting, Boston, pp. L.10.3.1 – L10.3.6, 2000.
  84. K. M. Flores, D. Suh, R. Howell, P. Asoka-Kumar, P.A. Sterne, and R. H. Dauskardt, “Flow and Fracture of Bulk Metallic Glass Alloys and Their Composites,” in Supercooled Liquid, Bulk Glassy, and Nanocrystalline States of Alloys, Proceedings of the Fall MRS Meeting, Boston, v. 644, pp. L.9.5.1 – L.9.5.6, 2000.
  85. M. Jenkins, J. Snodgrass, A. Chesterman, R. H. Dauskardt, and J. C. Bravman, “Atomic Force Microscopy Studies of Fracture Surfaces from Oxide/Polymer Interfaces,” in Structure-Property Relationships of Oxide surfaces and Interfaces, Proceedings of the Fall MRS Meeting, Boston, v. 664, pp. AA2.7.1 – AA2.7.5, 2000.
  86. K. Nagarajan and R.H. Dauskardt, “Adhesion and Reliability of Underfill/Substrate interfaces in Microelectronic Packages: Metrology and Characterization”, SRC Consortium Meeting, Albany, New York, October 2000.
  87. M. Jenkins, J. Snodgrass, R. H. Dauskardt, and J. C. Bravman, “Chemical and Structural Characterization of Silane Adhesion Promoting Films for Use in Microelectronic Packaging,” in Interfaces, Adhesion, and Processing in Polymer Systems, Proceedings of the Spring MRS Meeting, pp. FF5.12.1 – FF5.12.6, San Francisco, 2000.
  88. J. Snodgrass and R. H. Dauskardt, “The effect of Fatigue on The Adhesion and Subcritical Debonding of Benzocyclobutene/Silicon Dioxide Interfaces,” in Materials Reliability in Microelectronics X, Proceedings of the Spring MRS Meeting, pp. 1-6, San Francisco, 2000.
  89. A. M. Fitzgerald, R. H. Dauskardt, and T. W. Kenny, “High-resolution measurement of crack growth in micromachined single crystal silicon,” in Materials Science of Microelectromechanical Systems (MEMS) Devices II Symposium, 29 Nov.-1 Dec., Proceedings of the Fall MRS Meeting, pp. 43-48, 1999.
  90. D. Pantelidis, J. Snodgrass, R. H. Dauskardt, and J. C. Bravman, “Study of Crack Propagation at an Oxide/Polymer Interface under Varying Loading Conditions,” in Thin Films-Stresses and Mechanical Properties VIII Symposium, 29 Nov.-3 Dec. Proceedings of the Fall MRS Meeting, pp. 407-412, 1999.
  91. S-Y. Kook, A. Kirtikar, and R. H. Dauskardt, “Adhesion and Progressive Debonding of Polymer/Metal Interfaces:  Effects of Temperature and Environment,” in Materials Reliability in Microelectronics IX, Proceedings of the Spring MRS Meeting, v 563, pp. 263-268, San Francisco, 1999.
  92. M. Lane, N. Krishna, I. Hashim, and R. H. Dauskardt, “Effect of Nitrogen on Adhesion of the Ta/SiO2 Interface,” in Materials Reliability in Microelectronics IX, v 563, pp. 281-286, Proceedings of the Spring MRS Meeting, San Francisco, 1999.
  93. M. Lane, R. H. Dauskardt, Qing Ma, H. Fujimoto, and N. Krishna, “Subcritical Debonding of Multilayer Interconnect Structures:  Temperature and Humidity Effects,” in Materials Reliability in Microelectronics IX, v 563, pp. 251-256, Proceedings of the Spring MRS Meeting, San Francisco, 1999.
  94. J. M. Snodgrass, D. Pantelidis, J.C. Bravman, and R. H. Dauskardt, “The Effect of Environment and Fatigue on the Adhesion and Subcritical Debonding of Dielectric Polymers,” in Low K Dielectric Materials,  v. 565, pp. 123-128, Proceedings of the Spring MRS Meeting, San Francisco, 1999.
  95. L. C. Wang, Z. Mei, and R. H. Dauskardt, “Reliability of Electroless Processed Thin Layered Solder Joints,” in Materials Reliability in Microelectronics IX, pp. 3-8, Proceedings of the Spring MRS Meeting, San Francisco, 1999.
  96. A. M. Fitzgerald, R.H. Dauskardt, and T.W. Kenny, “Fracture Toughness of Plasma-Etched Single Crystal Silicon and Implications for MEMS Design,” in Symposium on Microelectromechanical Systems, Transducers 99 10th International Conference on Solid-State Sensors and Actuators, Sendai, Japan, pp. 928-931, 1999.
  97. K. M. Flores, D. Suh, and R. H. Dauskardt, "Environmental and Stress State Effects on Fracture and Fatigue Crack-Growth in Zr-Ti-Ni-Cu-Be Bulk Amorphous Metals," in Bulk Metallic Glasses, edited by A. Inoue, W. Johnson, and C. T. Liu, pp. 355 – 360, Proceedings of the MRS Annual Meeting, 554, Boston, MA, 1999. 
  98. J. M. Snodgrass and R.H. Dauskardt, “Adhesion and Subcritical Debonding of Interfaces for Die Attach Applications,” TECHCON '98 Proceedings, p. 86, Las Vegas, Oct. 1998.
  99. S-Y. Kook, A. Kirtikar and R.H. Dauskardt, “Adhesion and Progressive Debonding of Polymer/Metal Interfaces in Microelectronic Applications,” TECHCON '98 Proceedings, p. 83, Las Vegas, Oct. 1998.
  100. J. Lin, J.M. Snodgrass and R.H. Dauskardt ,”Effect of a Photochemically Activated Adhesion Promoter on the Adhesion of PMMA/Si Interfaces,” TECHCON '98 Proceedings, p. 81, Las Vegas, Oct. 1998.
  101. J. M. Snodgrass, G. Hotchkiss, and R. H. Dauskardt, “Adhesion and Subcritical Debonding of Polymer Interfaces for Microelectronic Packaging,” in Electronic Packaging Materials Science X Symposium, Proceedings of the Spring MRS Meeting, 14-16 April 1998, San Francisco, CA, USA, pp. 37-43, 1998.
  102. A. M. Fitzgerald, R. Suryanarayanan Iyer, R.H. Dauskardt, and T.W. Kenny, “Fracture and Sub-Critical Crack Growth Behavior of Micromachined Single Crystal Silicon Structures,” in Symposium on Microelectromechanical Systems, 1998 ASME International Mechanical Engineering Congress & Exopsition, Nov. 15-20, pp. 395-399, Anaheim, California, 1998.
  103. G. Cornella, R.P. Vinci, R. Suryanarayanan Iyer, R.H. Dauskardt, and J.C. Bravman, "Observations of Low Cycle Fatigue of Al Thin Films for MEMS Applications," in Proceedings of MRS Annual Meeting, vol. 518, pp. 81-86, Boston, MA, 1998.
  104. M. Lane, W. Ni, R. H. Dauskardt, Q. Ma, H. Fujimoto and N. Krishna, "Effects of Interface Nonplanarity on the Interface Fracture Energy on the TiN/SiO2 System," in Thin Film Stresses and Mechanical Properties VII, vol. 516, Editors: T. Marieb, J. Bravman, M.A. Korhonen, J.R. Lloyd, Proceedings of MRS Annual Meeting, Boston, MA, pp. 357 – 362, 1998.
  105. J. M. Snodgrass, S.-Y. Kook, A. Kirtikar and R. H. Dauskardt, “Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications,” in Proceedings of the 1997 International Mechanical Engineering Congress and Exposition, pp. 33-39, ASTM, Dallas, TX, 1997.
  106. M. Lane, R. Ware, Q. Ma, H. Fujimoto, and R. H. Dauskardt, "Progressive Debonding of Multi-Layer Interconnect Structures," in Materials Reliability in Microelectronics VII, Proceedings of MRS Annual Meeting, VOL 473, Editors: J.J.Clement, J.D.Sanchez, Jr., K.S.Krisch, Z.Suo, R.R.Keller, San Francisco, CA, pp. 21-26, 31 Mar.-3 Apr., 1997.
  107. Q. Ma, J. Bumgarner, H. Fujimoto, M. Lane and R. H. Dauskardt, "Adhesion Measurement of Interfaces in Multilayer Interconnect Structures," in Materials Reliability in Microelectronics VII, Proceedings of MRS Annual Meeting, San Francisco, CA, pp. 3-14, 1997.
  108. K. L. Ohashi, A. C. Romero, P. D. McGowan, W. J. Maloney and R. H. Dauskardt, "Adhesion and Reliability of Interfaces in Cemented Total Joint Arthroplasties," in Proceedings of the Orthopaedic Research Society, Atlanta, GA, 1996.
  109. Q. Ma, H. Fujimoto, P. Flinn, V. Jain, F. Adibi-Rizi, F. Moghadam, and R. H. Dauskardt, "Quantitative Measurement of Interface Fracture Energy in Multi-Layer Thin Film Structures," in Materials Reliability in Microelectronics V,  Proceedings of MRS Annual Meeting, San Francisco, CA, pp. 91-96, 1995.
  110. R. H. Dauskardt, N. Christine Nguyen, and W. J. Maloney, "Mechanics and Mechanisms of Crack Growth At on Near Interfaces in Cemented Load Bearing Prosthetics," in Proceedings of the 19th Annual Meeting of the American Society of Biomechanics,  pp. 149-50, Stanford, CA, 1995.
  111. R. O. Ritchie, R. H. Dauskardt, W. W. Gerberich, A. Stojny and E. Lilleodden, "Fracture, Fatigue and Indentation Behavior of Pyrolytic Carbon for Biomedical Applications," in Mechanical Behavior of Diamond and Other Forms of Carbon,  MRS Symposium Proceedings, vol. 383, pp. 229-254, M.D. Drory, M.S. Donley, D. Bogy and J. E. Field, eds., Materials Research Society, Pittsburgh, PA, 1995.
  112. C. J. Gilbert, R. H. Dauskardt and R. O. Ritchie, "Microstructural Mechanisms of Cyclic Fatigue-Crack Propagation in Grain Bridging Ceramics," Proceedings of the Eighth World Ceramic Congress (CIMTEC), 1995.
  113. R. H. Dauskardt and M. R. Mitchell, "High Temperature Fatigue-Crack Growth Experiments in Ceramics and Ceramic-Matrix Composites," in Failure of Engineering Materials at High Temperature, Proceedings of the 1994 SEM Spring Conference on Experimental Mechanics, Experimental Techniques, CT, 1994.
  114. R. O. Ritchie, K. T. Venkateswara Rao, and R. H. Dauskardt, "Fracture and Fatigue-Crack Propagation Behavior in High-Temperature Ceramics and Intermetallics," in The Prospect Towards Practical Utilization of Ultra-High Temperature Materials, Proceedings of the Third International Symposium on Ultra-High Temperature Materials '93, Tajimi, Japan, pp. 33-41,1993.
  115. R. O. Ritchie, R. H. Dauskardt, and K. T. Venkateswara Rao, "Matrix and Interfacial Fatigue-Crack Growth in Advanced Structural Materials," in Advanced Materials - New Processes and Reliability, Proceedings of the Third International SAMPE Symposium, T. Kishi, N. Takada, and Y. Kagawa, Society for the Advancement of Material and Process Engineering, Tokyo, Japan, vol. 2, pp. 1966-1975, 1993.
  116. R. O. Ritchie, and R. H. Dauskardt, "Fatigue-Crack Propagation Behavior in Ceramic Materials." Transactions of the Materials Research Society of Japan, vol. 14A, pp. 359-364, Dec. 1994.
  117. R. O. Ritchie, R. M. Cannon, B. J. Dalgleish, R. H. Dauskardt, and J. M. McNaney, "On the Strength and Toughness of Structural Ceramics Bonded to Metals," Transactions of the Materials Research Society of Japan, vol. 14A, pp. 409-412, Dec. 1994.
  118. R. H. Dauskardt, R. O. Ritchie, and A. M. Brendzel, "Role of Small Cracks in the Structural Integrity of Pyrolytic Carbon Heart-Valve Prostheses," in Bioceramics, vol. 6, Proceedings of the Sixth International Symposium on Ceramics in Medicine, P. Ducheyne and D. Christiansen, eds., Butterworth-Heinemann, Oxford, U.K., pp. 229-236, 1993.
  119. R. O. Ritchie, R. H. Dauskardt and K. T. Venkateswara Rao, "Fatigue-Crack Propagation Behavior  in Monolithic and Composite Ceramics and Intermetallics," Physiochemical Mechanics of Materials, vol. 30 [3], 1994. (Also published in the proceedings of the Eighth International Conference on Fatigue (ICF-8), Kiev, Ukraine, V. V. Panasyuk, P. Rama Rao and D. M. R. Taplin, eds., Pergamon Press, Oxford, U. K., 277-317, 1994.)
  120. R. O. Ritchie, K. T. Venkateswara Rao and R. H. Dauskardt, "Fatigue-Crack Propagation in Advanced Materials," in Fatigue '93, Proceedings of the Fifth International Conference on Fatigue and Fatigue Thresholds, J. -P. Bailon and J. I. Dickson, eds., EMAS Ltd., Warley, U. K., vol. 4, 1899-1918, 1993.
  121. J. C. Card, R. M. Cannon R. H. Dauskardt and R. O. Ritchie, "Stress-Corrosion Cracking at Ceramic-Metal Interfaces," in Joining and Adhesion of Advanced Inorganic Materials, MRS Symposium Proceedings, A. H. Carim, D. S. Schartz, R. S. Silberglitt and R. E. Loehman, eds., vol. 314, MRS, Pittsburg, PA,  pp. 109-116, 1993.
  122. M. J. Hoffman, R. H. Dauskardt, Y. -W. Mai and R. O. Ritchie, "A Review of the Mechanics and Mechanisms of Cyclic Fatigue-Crack Propagation in Transformation-Toughened Zirconia Ceramics," in Science and Technology of Zirconia V, S. P. S. Badwal, M. J. Bannister, and R. H. J. Hannink, eds., Technomic Publishing Company, Lancaster PA,  pp. 321-338, 1993.
  123. R. H. Dauskardt and R. O. Ritchie, "Cyclic Fatigue-Crack Growth in Pyrolytic-Carbon Materials: Implications for Prosthetic Heart-Valve Devices," Proceedings of the Fourth World Biomaterials Congress, Berlin, p. 478, 1992.
  124. R. H. Dauskardt and R. O. Ritchie, "Cyclic Fatigue-Crack Propagation in Ceramics and Ceramic Composites," in Proceedings of the Sixth International Conference on the Mechanical Behavior of Materials (ICM-6), Pergamon Press, Oxford, U. K., pp. 325-332, 1991.
  125. R. M. Cannon, B. J. Dalgleish, R. H. Dauskardt, R. M. Fisher, T. S. Oh and R. O. Ritchie, "Ceramic/Metal Interfaces: Monotonic and Cyclic Fracture Resistance," in Fatigue of Advanced Materials, Proceedings of the First International Engineering Foundation Conference on "Fatigue of Advanced Materials," Santa Barbara, CA, B. N. Cox, R. H. Dauskardt and R. O. Ritchie, eds., MCEP Publishers, UK, pp. 459-482, 1991.
  126. R. H. Dauskardt and R. O. Ritchie, "Cyclic Fatigue of Ceramics," in Fatigue of Advanced Materials, Proceedings of the First International Engineering Foundation Conference on "Fatigue of Advanced Materials," Santa Barbara, CA, B. N. Cox, R. H. Dauskardt and R. O. Ritchie, eds., MCEP Publishers, UK, pp. 133-151, 1991.
  127. R. O. Ritchie and R. H. Dauskardt, "Cyclic Fatigue-Crack Propagation Behavior in Pyrolytic Carbon-Coated Graphite for Prosthetic Heart-Valve Applications," in FATIGUE 90, Proceedings of the Fourth International Conference on Fatigue and Fatigue Thresholds, Honolulu, Hawaii, H. Kitagawa and T. Tanaka, eds., MCEP Ltd., Birmingham, U.K., pp. 819-826, 1990.
  128. A. A. Steffen, R. H. Dauskardt and R. O. Ritchie, "Cyclic Fatigue-Crack Propagation in Ceramics:  Long and Small Crack Behavior," in FATIGUE 90, Proceedings of the Fourth International Conference on Fatigue and Fatigue Thresholds, Honolulu, Hawaii, H. Kitagawa and T. Tanaka, eds., MCEP Ltd., Birmingham, U.K., pp. 745-752, 1990.
  129. R. H. Dauskardt, D. B. Marshall and R. O. Ritchie, "Cyclic Fatigue-Crack Propagation in Ceramics: Behavior in Overaged and Partially-Stabilized MgO-Zirconia", presented at the Joint Symposia on Structural Ceramics/Fracture Mechanics, Materials Research Society International Meeting on "Advanced Materials", Proceedings, Y. Hamano, O. Kamigaito, T. Kishi and M. Sakai, eds., MRS, Pittsburgh, PA, vol. 5, pp. 543-550, 1989.
  130. R. H. Dauskardt, T. W. Duerig and R. O. Ritchie, "Effects of In Situ Phase Transformation on Fatigue-Crack Propagation in Titanium-Nickel Shape-Memory Alloys", presented at the Symposium on Shape Memory Materials, Materials Research Society International Meeting on "Advanced Materials", Proceedings, K. Otsuka and K. Shimiza, eds., MRS, Pittsburgh, PA, vol. 9, pp. 243- 249, 1989.
  131. D. K. Veirs, G. M. Rosenblatt, R. H. Dauskardt and R. O. Ritchie, "Two-Dimensional Spatially Resolved Raman Spectroscopy of Solid Materials", in Microbeam Analysis - 1988, D. E. Newburg, ed., San Francisco Press, CA, pp. 179-181, 1988.
  132. R. H. Dauskardt and R. O. Ritchie, "Fatigue Crack Propagation Behavior in Pressure Vessel Steels for High Pressure Hydrogen Service", in High-Strength Steels for High-Pressure Containments, ed. E. G. Nisbett, ASME PVP-vol. 114/Mpc-vol. 27, American Society for Mechanical Engineers, New York, NY, pp. 17-26, July 1986. 
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