Skip to content Skip to navigation

Qiran Xiao

Qiran Xiao

Ph.D. Stanford University, Materials Science and Engineering, In progress
M.S. Stanford University, Materials Science and Engineering, 2015
B.S. Rensselaer Polytechnic Institute, Materials Science and Engineering, 2013

Contact

Office: 
Durand Building, Rm. 111

Research Interests

I studied subjects ranging from interface reliability to self-assembled novel structures. A broad range of materials characterization techniques has been learned and successfully applied, including the most sophisticated and state-of-the-art Transmission Electron Microscopy (TEM).

Specifically, my time has been devoted to

  1. structural and chemical characterization of self-assembled molecular layers
  2. surface functionalization of metals and semiconductor materials
  3. reliability/mechanical stability characterizations of thin-film structures

 

Metal Adhesion

Simultaneous Cu-oxide Reduction and Hybrid-layer Formation

The presence of weak Cu-oxide has detrimental implications for the adhesion, moisture sensitivity, stress- and electro-migration of Cu bondlines in advanced packaging, often leading to premature device failure. We developed a novel, low-cost, single-step sol-gel synthetic route capable of reducing the weak Cu-oxide while simultaneously depositing a high-performance hybrid layer (HL). The HL acts both as an adhesion layer at the Cu/epoxy interface, as well as a barrier film that prevents moisture degradation and Cu stress- and electro-migration. 

My work showing the grain structure of the Cu film supported on the Si substrate. Image was taken using the sperical-aberration corrected (environmental) Transmission Electron Microscope (TEM) at 300 kV at the Stanford Nano Shared Facility (SNSF).

 

Semiconductor Adhesion

Exploring the Kinetics of Hybrid-layer Formation

The strength of bonding at epoxy/SiO2 interface and its susceptibility to environmental degradation have a profound impact on the lifetime and reliability of microelectronic devices. We examined the interface’s adhesion improvement as a result of hybrid-layer incorporation and the kinetics of hydrolysis and polycondensation of the molecular precursors.

 

Publications

  • Q. R. Xiao, B. Watson, R. H. Dauskardt, “Organothiol-Based Hybrid-Layer Strategy for High-Performance Copper Adhesion and Stress-Migration via Simultaneous Oxide Reduction”, Adv. Mater. Interfaces., 20163, 1600118.
  • Q. R. Xiao, M. Giachino, R. H. Dauskardt, “Controlling Kinetics of Heterogeneous Sol–Gel Solution for High-Performance Adhesive Hybrid Films”, J. of Sol-Gel Sci and Tech, 2016, 77, 620-626.
  • Q. R. Xiao, Y. P. Chen, T. Bereau, Y. F. Shi, “An in-silico walker”, Chemical Physics Letters, 2016, 659, 6-9.
  • Q. R. Xiao, L. P. Huang, Y. F. Shi, “Suppression of Shear Banding in Amorphous ZrCuAl Nanopillars by Irradiation”, J. Appl. Phys., 2013, 113.
  • P.J. Lezzi, Q.R. Xiao, M. Tomozawa, T. A. Blanchet, C.R. Kurkjian, “Strength Increase of Silica Glass Fibers by Surface Stress Relaxation: A New Mechanical Strengthening Method”, J. of Non-Crystalline Solids, 2013, 379, 95-106.
  • Q. R. Xiao, H. W. Sheng, Y. F. Shi, “Dominant Shear Band Observed in Amorphous ZrCuAl Nanowires under Simulated Compression”, MRS Communications, 2012, 2, 13-16.

 

Conference Proceedings and Presentations

  • Q. R. Xiao, B. Watson, R. H. Dauskardt, “Organothiol-Based Hybrid-Layer Strategy for High-Performance Copper Adhesion and Stress-Migration via Simultaneous Oxide Reduction”, Materials Research Society Spring Meeting, Phoenix, Arizona, March, 2016.
  • Q. R. Xiao, B. Watson, R. H. Dauskardt, “Low-Cost, Single-Step Hybrid Bond/Barrier Films for Cu Bondlines in Advanced Packaging”, Materials Research Society (MRS) Spring Meeting, San Francisco, CA, April, 2015.
  • Q. R. Xiao, B. Watson, R. H. Dauskardt, “Low-Cost, Single-Step Hybrid Bond/Barrier Films for Cu Bondlines in Advanced Packaging”, SystemX Conference, Stanford University, November, 2014.
  • Q. R. Xiao, L. P. Huang, Y. F. Shi, “Irradiation suppresses shear banding in Zr-based MG system”, American Physical Society March Meeting, Boston, March, 2012.
  • Q. R. Xiao, H. W. Sheng, Y. F. Shi, “Shear band formation in Zr-based MG system”, University Conference on Glass Science, Rensselaer Polytechnic Institute, August, 2011.

 

Awards

  • Enlight Foundation Graduate Fellowship (2013) 
  • Matthew Albert Hunter Prize in Metallurgical Engineering (2013)
  • Summa Cum Laude (2013)
  • Founders Award of Excellence (2012)