Inhwa Lee

Research Interests

Organic electronics have been highlighted because of their outstanding advantages such as solution process, light weight, fast and flexibility when compared to conventional electronics. However, the current organic electronics have critical problems with their low fracture resistance, environmental stability and defects evolution under mechanical loadings. Therefore, my ultimate goal in this field is to simultaneously improve the mechanical and electrical properties for reliable and high performance energy devices through interface engineering of multi-layered structures. 

Publications

• I. Lee, J. Noh, J.-Y. Lee*, and T.-S. Kim*, “Co-optimization of Adhesion and Power Conversion Efficiency of Organic Solar Cells by Controlling Surface Energy of Buffer Layers”, ACS Applied Materials & Interfaces, 9, 37395-37401, 2017
• I. Lee, J. H. Yun, H. J. Son, and T.-S. Kim*, “Accelerated degradation by weakened adhesion from additives in perovskite solar cell,” ACS Applied Materials & Interfaces, 9(8), 7029-7035, 2017 
• W. Kim, I. Lee, D. Y. Kim, Y.-Y. Yu, H.-Y. Jung, S. Kwon, W. S. Park and T.-S. Kim*, “Controlled Multiple Neutral Planes by Low Elastic Modulus Adhesive for Flexible Organic Photovoltaics,” Nanotechnology, 28, 194002, 2017
• I. Lee, G. W. Kim, M. Yang, and T.-S. Kim*, “Simultaneously Enhancing the Cohesion and Electrical Conductivity of PEDOT:PSS Conductive Polymer Films using DMSO Additives,” ACS Applied Materials & Interfaces, 8(1), 302-310, 2015
• Y.-H. Lee, Y. Kim, T.-I. Lee, I. Lee, J. Shin, H. S. Lee, T.-S. Kim, and J. W. Choi*, “Anomalous Stretchable Conductivity Using an Engineered Tricot Weave”, ACS Nano, 9(12), 12214-12223, 2015
• J. H. Yun, I. Lee, T.-S. Kim, M. J. Ko, J. Y. Kim, and H. J. Son*, “Synergistic Enhancement and Mechanism Study of Mechanical and Moisture Stability of Perovskite Solar Cells Introducing Polyethylene-imine into the CH3NH3PbI3/HTM Interface,” Journal of Materials Chemistry A, 3, 22176, 2015
• Y. K. Jeong, T.-w. Kwon, I. Lee, T.-S. Kim, A. Coskun*, and J. W. Choi*, “Millipede-inspired Structural Design Principles for High Performance Polysaccharide Binders in Silicon Anodes,” Energy and Environmental Science, 8, 1224-1230, 2015
• D. J. Kang, H.-H. Cho, I. Lee, K.-H. Kim, H. J. Kim, K. Liao, T.-S. Kim, and B. J. Kim*, “Enhancing Mechanical Properties of Highly Efficient Polymer Solar Cells Using Size-Tuned Polymer Nanoparticles,” ACS Applied Materials & Interfaces, 7, 2668-2676, 2015
• T.-w. Kwon, Y. K. Jeong, I. Lee, T.-S. Kim, J. W. Choi*, and A. Coskun*, “Systematic Molecular-Level Design of Binders Incorporating Meldrum`s Acid for Silicon Anodes in Lithium Rechargeable Batteries,” Advanced Materials, 26, 7979-7985, 2014
• I. Lee and T.-S. Kim*, “Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films,” Journal of the Microelectronics & Packaging Society, 21(1), 41-44, 2014
• J.-S. Kim, Y.-H. Lee, I. Lee, T.-S. Kim, M.-H. Ryou*, and J. W. Choi*, “Large Area Multi-stacked Lithium-ion Batteries for Flexible and Rollable Applications,” Journal of Materials Chemistry A, 2, 10862-10868, 2014
• Y. K. Jeong, T.-w. Kwon, I. Lee, T.-S. Kim, A. Coskun*, and J. W. Choi*, “Hyperbranched β-Cyclodextrin Polymer as an Effective Multidimensional Binder for Silicon Anodes in Lithium Rechargeable Batteries,” Nano Letters, 14, 864-870, 2014
• Y. Lee, J. Kim, J. Noh, I. Lee, H. Kim, S. Choi, J. Seo, M. Kim, S. Jeon, T.-S. Kim*, J. Lee*, and J. Choi*, “Wearable textile battery rechargeable by solar energy,” Nano Letters, 13(11), 5753-5761, 2013
• I. Lee, J. Lee, S. Ko*, and T.-S. Kim*, “Reinforcing Ag Nanoparticle Thin Films by Very Long Ag Nanowires,” Nanotechnology, 24, 415704, 2013
• J. Lee, P. Lee, H. Lee, S. Hong, I. Lee, J. Yeo, S. Lee, T.-S. Kim, D. Lee*, and S. Ko*, "Room-Temperature Nanosoldering of a Very Long Metal Nanowire Network by Conducting-Polymer-Assisted Joining for a Flexible Touch-Panel Application," Advanced Functional Materials, 23(34), 4171-7176, 2013. (front cover)
• J. Lee, I. Lee, T.-S. Kim, and J.-Y. Lee, "Efficient Welding of Silver Nanowire Networks without Post-Processing," Small, 9(17), 2887-2894, 2013
• M.-H. Ryou, J. Kim, I. Lee, S. Kim, Y. K. Jeong, S. Hong, J. H. Ryu, T.-S. Kim, J.-K. Park, H. Lee, J. W. Choi, " Mussel-Inspired Adhesive Binders for High-Performance Silicon Nanoparticle Anodes in Lithium-Ion Batteries,” Advanced Materials, 25(11), 1571-1576, 2013. (front piece article)
• I. Lee, S. Kim, J. Yun, I. Park, and T. Kim, “Interfacial toughening of solution processed Ag nanoparticle thin films by organic residuals,” Nanotechnology, 23, 485704, 2012

Conference Proceedings

• W. Kim, I. Lee and T.-S. Kim, “Controlled Multiple Neutral Planes by Low Elastic Modulus Adhesive”, ACEM2016, Jeju, Nov. 14-16, 2016
• I. Lee, G. W. Kim, M. Yang, T.-S. Kim, “Simultaneously Enhancing the Cohesion and Electrical Conductivity of PEDOT:PSS Conductive Polymer Films using DMSO Additives”, 2015 KSME Autumn conference, Gangwon, Dec. 16-18, 2015
• I. Lee, G.W. Kim, M. Yang, and T.-S. Kim, “Exploiting DMSO to Enhance Mechanical and Electrical Properties of PEDOT:PSS Conducting Polymer Films,” Materials Research Society Spring Meeting, San Francisco, USA, Apr. 06-10, 2015
• I. Lee and T.-S. Kim, "Improving Reliability of Silver Nanoparticle Thin Films", 2014 KSME Spring Meeting, Jeju, Feb. 26-28, 2014. (Outstanding Student Paper Award)
• I. Lee, and T.-S. Kim, “Research for Mechanical Reliability Improvement of Silver Nanoparticle Thin Films”, 2013 KSPE Fall Meeting, Pusan, Oct. 30 – Nov. 1, 2013
• I. Lee, J. Lee, S. Ko, and T.-S. Kim, “Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films”, 15th International Conference on Electronic Materials and Packaging, Ilsan, Oct. 6 – 9, 2013
• S. Kim, S. Won, I. Lee, T.-S. Kim, S. Lee, I. Park, “Adhesion and tensile characteristics of solution-processed Ag nanoparticle thin films," 2012 MRS Fall Meeting, Boston, MA, USA. Nov. 25-30, 2012
• I. Lee, S. Kim, J. Yun, I. Park, and T.-S. Kim, “Annealing-induced interfacial fracture energy of silver nanoparticle films on substrate for reliable printed electronics,” The Electrochemical Society Meeting, Honolulu, HI, USA, Oct. 7-12, 2012
• S. Kim, I. Lee, T. Kim, "Study on the bonding strength of the films for flexible electronic circuits," 2012 KSME Spring Meeting, Daejeon, Korea, Jun. 26 - 27, 2012
• S. Kim, I. Lee, J. Yun, T. Kim and I. Park, "Interfacial toughening of solution processed Ag  nanoparticle thin films by organic residuals," 2012 KSME Spring Meeting, Daejeon, Korea, May. 17 - 18, 2012
• T. Yoon, I. Lee, and T. Kim, “Mechanical Reliability of Cu/Low-k Interconnects and Underfill,” IEEE International 3D System Integration Conference, Osaka, Japan, Jan. 31 - Feb. 2, 2012
• I. Lee, S. Kim, J. Yoon, I. Park, and T. Kim, “Bonding Reliability of Silver Nanoparticles,” 2011 KSPE Autumn Meeting, Gyeongju, Korea, Oct. 27, 2011

Awards

Postdoctoral Fellowship Program for Foreign Researchers, The Korean Government, (2017)