Dauskardt Group - Andrew Kearney

Andrew Kearney

Ph.D. Candidate

Department of Materials Science and Engineering

Stanford University

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Email: avkearney@yahoo.com

Educational Background

Ph.D. Stanford University, Materials Science and Engineering, in progress
M.S. Stanford University, Materials Science and Engineering, 2006
B.A. University of Pennsylvania, Physics, 2000
B.S.E. University of Pennsylvania, Materials Science and Engineering, 2000

Research Interests

Adhesion of Ultrathin Nanoporous Polymer Layers

The objective of my research is to better understand the mechanics of both organic and inorganic nanoporous ultrathin (<250 nm) film materials, which are increasing being integrated into complex multilayer interconnect structures. Understanding the fracture and fatigue behavior of these nanoporous films will be vital to improve the reliability of such microelectronic devices. The fracture energy of 18% nanoporous polyarylene (PAE) polymer was twice that of dense versions. This surprising increase in fracture resistance with increasing porosity can be understood through the application of a ductile nano-void growth and coalescence fracture mechanics-based model, which predicts pore size must increase with close to a linear dependence on the volume fraction in order to increase rather than decrease the fracture energy. Independent characterization of the pore size as a function of volume fraction is shown to confirm predictions made by the model.

The reliability of interconnect structure can also be improved by incorporating specially designing die sealing structures around the perimeter of the device. These structures have been shown to locally improve the fracture and fatigue resistance compared to the low-k/Cu layers in the interior of the die, preventing cracks initiated during the wafer dicing process to propagating into active regions. This improved resistance to crack growth can be understood by large deflections caused by these die sealing structures.

Relevant Experience

Intel Corporation, Quality and Reliability Engineer (2000-2003)

Awards

Novellus/Semiconductor Research Corp Graduate Fellow, 2004
Benjamin Franklin Scholar (U. of Penn)
Alpha Sigma Mu Honors Society
Waldo Semon's Research Award (U. of Akron), 1999

Publications

Pore Size Scaling for Enhanced Fracture Resistance of Nanoporous Polymer Thin Films, (in preparation)
Fracture and Fatigue of Ultrathin Polymer Films, (in preparation)
Die Sealing in Cu/Low-k Interconnect Structures for Improved Yield and Reliability (in preparation)
Influence of Porosity and Film Thickness on Adhesion of Nanoporous Organic Dielectrics, Advanced Metallization Conference Proceedings, 2006
Unusual Fracture Behavior of Nanoporous Polymeric Thin-Films, 2005 Materials Research Society Conference Proceedings, vol. 880E, 2005

Presentations

A.V. Kearney, A.V. Vairagar, H. Geisler, E. Zschech, and R. H. Dauskardt, Assessing the Effect of Die Sealing in Cu/low-k Structures, to be presented at TECHCON 2007, Austin, TX, September 10-12, 2007.

A.V. Kearney, H. Chang, and R.H. Dauskardt, Fracture of Constrained Nanoporous Polymers¸ presented at the 2006 Materials Research Society Fall Meeting, Boston, MA, November 27 – December 1, 2006.

A.V. Kearney, H. Chang, C.E. Mohler, M.E. Mills, and R.H. Dauskardt, Fracture of Nanoporous Thin-Films, presented at the 2006 Materials Research Society Spring Meeting, San Francisco, CA, April 17-21, 2006.

A.V. Kearney and R. H. Dauskardt, Unusual Fracture Behavior of Nanoporous Polymeric Thin-Films, presented at the 2005 Materials Research Society Spring Meeting, San Francisco, CA, March 28 – April 1, 2005

Support

Novellus/Semiconductor Research Corp Graduate Fellowship, 2004

Department of Materials Science and Engineering, Stanford University

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